ATMEGA3290-16AU Atmel, ATMEGA3290-16AU Datasheet - Page 3

• Manufacturer Part Number: ATMEGA3290-16AU
• Description: IC AVR MCU 32K 16MHZ 100TQFP
• Manufacturer: Atmel
• Series: AVR® ATmegar

Specifications of ATMEGA3290-16AU

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: SPI, UART/USART, USI
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
• Number Of I /o: 69
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Processor Series: ATMEGA32x
• Core: AVR8
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Interface Type: SPI, USART, USI
• Maximum Clock Frequency: 16 MHz
• Number Of Programmable I/os: 54
• Number Of Timers: 3
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWAVR, EWAVR-BL
• Development Tools By Supplier: ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Package: 100TQFP
• Device Core: AVR
• Family Name: ATmega
• Maximum Speed: 16 MHz
• For Use With: ATSTK600-TQFP100 - STK600 SOCKET/ADAPTER 100-TQFP770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAG770-1005 - ISP 4PORT FOR ATMEL AVR MCU JTAG770-1004 - ISP 4PORT FOR ATMEL AVR MCU SPIATAVRISP2 - PROGRAMMER AVR IN SYSTEMATSTK504 - STARTER KIT AVR EXP MOD 100P LCDATJTAGICE2 - AVR ON-CHIP D-BUG SYSTEM
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 1-2.
2552KS–AVR–04/11
(USCK/SCL/PCINT4) PE4
(XCK/AIN0/PCINT2) PE2
(DI/SDA/PCINT5) PE5
(OC0A/PCINT12) PB4
(OC1A/PCINT13) PB5
(OC1B/PCINT14) PB6
(MOSI/PCINT10) PB2
(CLKO/PCINT7) PE7
(MISO/PCINT11) PB3
(AIN1/PCINT3) PE3
(RXD/PCINT0) PE0
(SCK/PCINT9) PB1
(TXD/PCINT1) PE1
(DO/PCINT6) PE6
(SS/PCINT8) PB0
Pinout ATmega329/649
LCDCAP
10
11
12
14
15
16
13
1
2
5
6
7
8
9
3
4
Note:
The large center pad underneath the QFN/MLF packages is made of metal and internally con-
nected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If
the center pad is left unconnected, the package might loosen from the board.
INDEX CORNER
ATmega329/649
ATmega329/3290/649/6490
39
38
35
34
33
48
47
46
45
44
43
42
41
40
37
36
PA3 (COM3)
PA4 (SEG0)
PA5 (SEG1)
PA6 (SEG2)
PA7 (SEG3)
PG2 (SEG4)
PC7 (SEG5)
PC5 (SEG7)
PC4 (SEG8)
PC3 (SEG9)
PC2 (SEG10)
PC1 (SEG11)
PC0 (SEG12)
PC6 (SEG6)
PG1 (SEG13)
PG0 (SEG14)
3