PIC32MX360F512L-80I/PT Microchip Technology, PIC32MX360F512L-80I/PT Datasheet - Page 17
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PIC32MX360F512L-80I/PT
Manufacturer Part Number
PIC32MX360F512L-80I/PT
Description
IC PIC MCU FLASH 512K 100-TQFP
Manufacturer
Microchip Technology
Series
PIC® 32MXr
Datasheets
1.MA320002.pdf
(208 pages)
2.DM320001.pdf
(44 pages)
3.PIC32MX320F032H-40IPT.pdf
(48 pages)
4.PIC32MX320F032H-40IPT.pdf
(66 pages)
5.PIC32MX320F032H-40IPT.pdf
(22 pages)
6.PIC32MX320F032H-40IPT.pdf
(626 pages)
7.PIC32MX320F064H-40IMR.pdf
(172 pages)
Specifications of PIC32MX360F512L-80I/PT
Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
100-TFQFP
Core Processor
MIPS32® M4K™
Core Size
32-Bit
Speed
80MHz
Connectivity
I²C, IrDA, LIN, PMP, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
85
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC32MX3xx
Core
MIPS
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
I2C , SPI , UART
Maximum Clock Frequency
80 MHz
Number Of Programmable I/os
85
Number Of Timers
5 x 16 bit
Operating Supply Voltage
2.3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM320001, DM320002, MA320001
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Controller Family/series
PIC32
No. Of I/o's
85
Ram Memory Size
32KB
Cpu Speed
80MHz
No. Of Timers
6
Embedded Interface Type
EUART, I2C, PSP, SPI
No. Of Pwm Channels
5
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1000 - PIC32 BREAKOUT BOARDAC244003 - TEST BD MPLAB REAL ICE LOOPBACKAC244006 - KIT MPLAB REAL ICE TRACEDM320001 - KIT EVAL PIC32 STARTERAC164333 - MODULE SKT FOR PM3 100QFP
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC32MX360F512L-80I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC32MX360F512L-80I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
2.0
2.1
Getting started with the PIC32MX3XX/4XX family of
32-bit Microcontrollers (MCU) requires attention to a
minimal set of device pin connections before
proceeding with development. The following is a list of
pin names, which must always be connected:
• All V
• All AV
• V
• MCLR pin
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
Additionally, the following pins may be required:
• V
© 2009 Microchip Technology Inc.
Note:
(see Section 2.2)
is not used)
(see Section 2.2)
(see Section 2.3)
(see Section 2.4)
Programming™ (ICSP™) and debugging purposes
(see Section 2.5)
source is used
(see Section 2.8)
reference for ADC module is implemented
Note:
REF
CAP
DD
+/V
/V
DD
GUIDELINES FOR GETTING
STARTED WITH 32-BIT
MICROCONTROLLERS
Basic Connection Requirements
DDCORE
and V
REF
and AV
reference source. Refer to the “PIC32MX
description of the PIC32MX MCU.
This data sheet summarizes the features of
the PIC32MX3XX/4XX family of devices. It
is not intended to be a comprehensive
Family Reference Manual” for a detailed
The manual is available from the Microchip
web site (www.Microchip.com/PIC32).
The AV
connected independent of ADC use and
ADC voltage reference source.
- pins used when external voltage
SS
SS
pins
DD
pins (regardless if ADC module
and AV
SS
pins must be
Preliminary
2.2
The use of decoupling capacitors on every pair of
power supply pins, such as V
AV
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
• Placement on the printed circuit board: The
• Handling high frequency noise: If the board is
• Maximizing performance: On the board layout
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within one-
quarter inch (6 mm) in length.
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
SS
is required. See Figure 2-1.
PIC32MX3XX/4XX
Decoupling Capacitors
DD
, V
DS61143F-page 15
SS
, AV
DD
, and