PIC18LF452-I/PT Microchip Technology, PIC18LF452-I/PT Datasheet - Page 164
![IC MCU FLASH 16KX16 A/D 44TQFP](/photos/6/82/68251/c04-076_pt_sml.jpg)
PIC18LF452-I/PT
Manufacturer Part Number
PIC18LF452-I/PT
Description
IC MCU FLASH 16KX16 A/D 44TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F242-ISO.pdf
(332 pages)
3.PIC18F242-ISO.pdf
(14 pages)
4.PIC18F242-ISO.pdf
(16 pages)
5.PIC18F242-ISO.pdf
(16 pages)
6.PIC18F242-ISO.pdf
(14 pages)
7.PIC18LF242-ISO.pdf
(36 pages)
8.PIC18F452-EP.pdf
(332 pages)
Specifications of PIC18LF452-I/PT
Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
44-TQFP, 44-VQFP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
34
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1.5 KB
Interface Type
MSSP/SPI/I2C/PSP/USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
34
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Data Rom Size
256 B
Height
1 mm
Length
10 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
10 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18LF452-I/PT
Manufacturer:
XILINX
Quantity:
349
Company:
Part Number:
PIC18LF452-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18LF452-I/PT
Manufacturer:
MICROCH
Quantity:
20 000
PIC18FXX2
15.4.17.2
During a Repeated START condition, a bus collision
occurs if:
a)
b)
When the user de-asserts SDA and the pin is allowed
to float high, the BRG is loaded with SSPADD<6:0>
and counts down to 0. The SCL pin is then de-asserted,
and when sampled high, the SDA pin is sampled.
If SDA is low, a bus collision has occurred (i.e., another
master
Figure 15-29). If SDA is sampled high, the BRG is
FIGURE 15-29:
FIGURE 15-30:
DS39564C-page 162
A low level is sampled on SDA when SCL goes
from low level to high level.
SCL goes low before SDA is asserted low, indi-
cating that another master is attempting to
transmit a data ’1’.
is
SDA
SCL
BCLIF
RSEN
S
SSPIF
SDA
SCL
RSEN
BCLIF
S
SSPIF
attempting
Bus Collision During a Repeated
START Condition
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
to
transmit
SCL goes low before SDA,
Set BCLIF. Release SDA and SCL.
a
data
’0’,
T
BRG
Sample SDA when SCL goes high.
If SDA = 0, set BCLIF and release SDA and SCL.
reloaded and begins counting. If SDA goes from high to
low before the BRG times out, no bus collision occurs
because no two masters can assert SDA at exactly the
same time.
If SCL goes from high to low before the BRG times out
and SDA has not already been asserted, a bus collision
occurs. In this case, another master is attempting to
transmit a data ’1’ during the Repeated START
condition, Figure 15-30.
If, at the end of the BRG time-out both SCL and SDA
are still high, the SDA pin is driven low and the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCL pin, the SCL pin is
driven low and the Repeated START condition is
complete.
T
Cleared in software
© 2006 Microchip Technology Inc.
BRG
Interrupt cleared
in software
'0'
'0'
'0'