DSPIC33FJ256MC710-I/PF Microchip Technology, DSPIC33FJ256MC710-I/PF Datasheet - Page 276

• Manufacturer Part Number: DSPIC33FJ256MC710-I/PF
• Description: IC DSPIC MCU/DSP 256K 100TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ256MC710-I/PF

• Program Memory Type: FLASH
• Program Memory Size: 256KB (256K x 8)
• Package / Case: 100-TQFP, 100-VQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 85
• Ram Size: 30K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 24x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 85
• Data Ram Size: 30 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240002, DM330011, DM300019, DV164033, MA330011, MA330012, DM300024
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1001 - DSPIC33 BREAKOUT BOARDMA330013 - MODULE PLUG-IN DSPIC33 100TQFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164323 - MODULE SKT FOR 100TQFP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

dsPIC33FJXXXMCX06/X08/X10
26.1
TABLE 26-1:
TABLE 26-2:
TABLE 26-3:
DS70287C-page 274
DC5
dsPIC33FJXXXMCX06/X08/X10
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 100-pin TQFP (14x14x1 mm)
Package Thermal Resistance, 100-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 80-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 64-pin TQFP (10x10x1 mm)
Note 1:
Characteristic
Operating Junction Temperature Range
DC Characteristics
P
I/O = Σ ({V
Operating Ambient Temperature Range
INT
Junction to ambient thermal resistance, Theta-
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
– V
V
DD
(in Volts)
DD
3.0-3.6V
OH
Characteristic
– Σ I
Range
} x I
Rating
OH
OH
)
) + Σ (V
OL
x I
OL
)
-40°C to +85°C
Temp Range
(in °C)
JA
(
θ
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
θ
θ
θ
θ
P
T
T
JA
JA
JA
JA
A
D
J
dsPIC33FJXXXMCX06/X08/X10
Min
Typ
-40
-40
40
40
40
40
(T
© 2009 Microchip Technology Inc.
P
J
INT
– T
Max
Typ
Max MIPS
—
—
—
—
—
—
+ P
A
)/θ
40
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
+125
Max
Unit
+85
Notes
Unit
°C
°C
W
W
1
1
1
1