STM8S105C6T6 STMicroelectronics, STM8S105C6T6 Datasheet - Page 5
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STM8S105C6T6
Manufacturer Part Number
STM8S105C6T6
Description
MCU 32KB FLASH MEM 16MHZ 48-LQFP
Manufacturer
STMicroelectronics
Series
STM8Sr
Datasheet
1.STM8S105C4T6.pdf
(127 pages)
Specifications of STM8S105C6T6
Core Processor
STM8
Core Size
8-Bit
Speed
16MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
38
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.95 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
Processor Series
STM8S10x
Core
STM8
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
38
Number Of Timers
5
Operating Supply Voltage
2.95 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWSTM8
Development Tools By Supplier
STM8/128-MCKIT, STM8S-DISCOVERY, ST-LINK, STICE-SYS001, STX-RLINK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel
For Use With
497-10040 - EVAL KIT STM8S DISCOVERY497-10593 - KIT STARTER FOR STM8S207/8 SER
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-8946
STM8S105C6T6
STM8S105C6T6
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STM8S105xx
List of tables
Table 48. EMS data ..............................................................................................................................101
Table 49. EMI data ...............................................................................................................................102
Table 50. ESD absolute maximum ratings ...........................................................................................103
Table 51. Electrical sensitivities ...........................................................................................................103
Table 52. 48-pin low profile quad flat package mechanical data .........................................................104
Table 53. 44-pin low profile quad flat package mechanical data .........................................................106
Table 54. 32-pin low profile quad flat package mechanical data .........................................................123
Table 55. 32-lead very thin fine pitch quad flat no-lead package mechanical data ..............................111
Table 56. 32-lead, ultra thin, fine pitch quad flat no-lead package mechanical data ...........................111
Table 57. 32-lead shrink plastic DIP (400 ml) package mechanical data ............................................112
(1)
Table 58. Thermal characteristics
....................................................................................................114
Table 59. Document revision history ...................................................................................................123
DocID14771 Rev 10
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