STM32F100V8T6B STMicroelectronics, STM32F100V8T6B Datasheet - Page 34

• Manufacturer Part Number: STM32F100V8T6B
• Description: MCU 32BIT 64K FLASH 100LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F100V8T6B

• Featured Product: STM32 Value Line
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 24MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 80
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Processor Series: STM32F100x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 24 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 6
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: STM32100B-EVAL
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 16 Channel
• On-chip Dac: 12 bit, 2 Channel
• For Use With: STM32100B-EVAL - EVAL BOARD FOR STM32F100VBT6
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-10658; STM32F100V8T6B

Electrical characteristics
5.3
5.3.1
34/86
Table 6.
1. All main power (V
2. I
3. Negative injection disturbs the analog performance of the device. See note in
4. When several inputs are submitted to a current injection, the maximum I
Table 7.
Operating conditions
General operating conditions
Table 8.
I
Symbol
V
INJ(PIN)
I
supply, in the permitted range.
cannot be respected, the injection current must be limited externally to the I
injection is induced by V
characteristics.
positive and negative injected currents (instantaneous values). These results are based on
characterization with I
f
f
INJ(PIN)
f
PCLK1
PCLK2
DDA
HCLK
Symbol
V
INJ(PIN)
DD
Symbol
I
I
VDD
VSS
I
T
IO
(1)
STG
T
J
(2)(3)
must never be exceeded. This is implicitly insured if V
(2)
Current characteristics
Thermal characteristics
General operating conditions
Internal AHB clock frequency
Internal APB1 clock frequency
Internal APB2 clock frequency
Standard operating voltage
Analog operating voltage
(ADC not used)
Analog operating voltage
(ADC used)
Total current into V
Total current out of V
Output current sunk by any I/O and control pin
Output current source by any I/Os and control pin
Injected current on NRST pin
Injected current on High-speed external OSC_IN and Low-
speed external OSC_IN pins
Injected current on the PA5, PA6 and PA7 pins
Injected current on any other pin
Total injected current (sum of all I/O and control pins)
DD
, V
Storage temperature range
Maximum junction temperature
DDA
INJ(PIN)
Parameter
IN
>V
) and ground (V
DD
STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
maximum current injection on four I/O port pins of the device.
while a negative injection is induced by V
Doc ID 16455 Rev 5
DD
SS
/V
Ratings
SS
DDA
ground lines (sink)
, V
Ratings
SSA
Must be the same potential
as V
power lines (source)
) pins must always be connected to the external power
DD
(4)
Conditions
IN
maximum is respected. If V
(1)
(4)
(1)
INJ(PIN)
IN
<V
INJ(PIN)
(4)
Section 5.3.16: 12-bit ADC
SS
–65 to +150
is the absolute sum of the
.
Min
value. A positive
2.4
Value
150
0
0
0
2
2
+5 / –0
Max.
± 25
150
150
25
± 5
± 5
± 5
25
IN
Max
3.6
3.6
3.6
24
24
24
maximum
Unit
MHz
Unit
Unit
°C
°C
mA
V
V