STM32F100VBT6B STMicroelectronics, STM32F100VBT6B Datasheet - Page 50
![MCU 32BIT 128K FLASH 100LQFP](/photos/12/15/121536/stmicroelectronics-_100-lqfp_sml.jpg)
STM32F100VBT6B
Manufacturer Part Number
STM32F100VBT6B
Description
MCU 32BIT 128K FLASH 100LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Specifications of STM32F100VBT6B
Featured Product
STM32 Value Line
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
24MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
80
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
STM32F100x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
24 MHz
Number Of Programmable I/os
80
Number Of Timers
6
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
STM32100B-EVAL
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
On-chip Dac
12 bit, 2 Channel
For Use With
STM32100B-EVAL - EVAL BOARD FOR STM32F100VBT6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-10659
STM32F100VBT6B
STM32F100VBT6B
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F100VBT6B
Manufacturer:
STMicroelectronics
Quantity:
5 850
Company:
Part Number:
STM32F100VBT6B
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STM32F100VBT6B
Manufacturer:
ST
Quantity:
20 000
Company:
Part Number:
STM32F100VBT6BTR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Electrical characteristics
50/87
Low-speed internal (LSI) RC oscillator
Table 24.
1. V
2. Based on characterization, not tested in production.
3. Guaranteed by design, not tested in production.
Wakeup time from low-power mode
The wakeup times given in
RC oscillator. The clock source used to wake up the device depends from the current
operating mode:
●
●
All timings are derived from tests performed under the ambient temperature and V
voltage conditions summarized in
Table 25.
1. The wakeup times are measured from the wakeup event to the point at which the user application code
I
t
Symbol
DD(LSI)
su(LSI)
Δf
reads the first instruction.
t
t
t
WUSLEEP
WUSTDBY
DD
f
WUSTOP
LSI(T)
Stop or Standby mode: the clock source is the RC oscillator
Sleep mode: the clock source is the clock that was set before entering Sleep mode.
LSI
Symbol
= 3 V, T
(3)
(3)
(1)
(1)
(1)
LSI oscillator characteristics
Low-power mode wakeup timings
Frequency
Temperature-related frequency drift
LSI oscillator startup time
LSI oscillator power consumption
A
= –40 to 105 °C °C unless otherwise specified.
Wakeup from Sleep mode
Wakeup from Stop mode (regulator in run mode)
Wakeup from Stop mode (regulator in low-power mode)
Wakeup from Standby mode
Parameter
Table 25
STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
Doc ID 16455 Rev 6
Table
are measured on a wakeup phase with an 8-MHz HSI
Parameter
8.
(1)
(2)
Min
30
-9
0.65
Typ
40
Max
1.2
60
85
Typ
1.8
3.6
5.4
9
50
DD
Unit
supply
kHz
Unit
µA
µs
%
µs
µs
µs