ST72F264G2M6 STMicroelectronics, ST72F264G2M6 Datasheet - Page 134

• Manufacturer Part Number: ST72F264G2M6
• Description: IC MCU 8BIT 8K 28 SOIC
• Manufacturer: STMicroelectronics
• Series: ST7r

Specifications of ST72F264G2M6

• Core Processor: ST7
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Processor Series: ST72F2x
• Core: ST7
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C/SCI/SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 3
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: ST7F264-IND/USB, ST72F34X-SK/RAIS, ST7MDT10-DVP3, ST7MDT10-EMU3, STX-RLINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 6-ch x 10-bit
• Controller Family/series: ST7
• No. Of I/o's: 22
• Ram Memory Size: 256Byte
• Cpu Speed: 8MHz
• No. Of Timers: 2
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• For Use With: 497-6423 - BOARD EVAL BASED ON ST72264G1497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-2106-5

ST72260Gx, ST72262Gx, ST72264Gx
SUPPLY CURRENT CHARACTERISTICS (Cont’d)
13.4.4 On-chip peripherals
Notes:
1. Data based on a differential I
2. Data based on a differential I
3. Data based on a differential I
4. Data based on a differential I
5. Data based on a differential I
134/172
I
Symbol
I
I
I
I
DD(ADC)
counter stopped (only TIMD bit set). Data valid for one timer.
communication at maximum speed (data sent equal to FFh).This measurement includes the pad toggling consumption.
tinuous transmission of AA +RE enabled and SCI off. This measurement includes the pad toggling consumption.
communication at 300kHz (data sent equal to AAh). This measurement includes the pad toggling consumption
(4.7kOhm external pull-up on clock and data lines).
(f
DD(TIM)
DD(SPI)
DD(SCI)
DD(I2C)
ADC
=4MHz).
16-bit Timer supply current
SPI supply current
SCI supply current
I2C supply current
ADC supply current when converting
DD
DD
DD
DD
DD
4)
2)
3)
Parameter
measurement between reset configuration (SPI disabled) and a permanent SPI master
measurement between SCI running at maximum speed configuration (500 kbaud, con-
measurement between reset configuration (I2C disabled) and a permanent I2C master
measurement between reset configuration (timer counter running at f
measurement between reset configuration (ADC off) and continuous A/D conversion
1)
5)
f
f
f
f
f
f
f
f
f
CPU
CPU
CPU
CPU
CPU
CPU
CPU
CPU
ADC
=4MHz
=8MHz
=4MHz
=8MHz
=4MHz
=8MHz
=4MHz
=8MHz
=4MHz
Conditions
V
V
V
V
V
V
V
V
V
V
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
=3.0V
=5.0V
=3.0V
=5.0V
=3.0V
=5.0V
=3.0V
=5.0V
=3.0V
=5.0V
CPU
Typ
200
300
200
250
350
650
350
500
500
600
/2) and timer
Unit
µA