ST72F321J9T6 STMicroelectronics, ST72F321J9T6 Datasheet - Page 174
ST72F321J9T6
Manufacturer Part Number
ST72F321J9T6
Description
MCU 8BIT 60KB FLASH 44TQFP
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet
1.ST72F321AR7T6.pdf
(193 pages)
Specifications of ST72F321J9T6
Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
32
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3.8 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-TQFP, 44-VQFP
Processor Series
ST72F3x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
2048 B
Interface Type
I2C, SCI, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
48
Number Of Timers
5
Operating Supply Voltage
3.8 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7F521-IND/USB, ST7232X-EVAL, ST7MDT20-DVP3, ST7MDT20-DVP3, STX-RLINK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
For Use With
497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
497-4844
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ST72F321J9T6
Manufacturer:
STMicroelectronics
Quantity:
10 000
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ST72321Rx ST72321ARx ST72321Jx
13.3 SOLDERING AND GLUEABILITY INFORMATION
Refer to JEDEC specification JSTD020D for a de-
scription of the recommended reflow oven profile
for these packages.
In order to meet environmental requirements, ST
offers this device in different grades of ECO-
PACK
vironmental compliance. ECOPACK
174/193
®
packages, depending on their level of en-
®
specifica-
tions, grade definitions and product status are
available at: www.st.com. ECOPACK
trademark.
Recommended glue for SMD plastic packages
dedicated to molding compound with silicone:
■
■
Heraeus: PD945, PD955
Loctite: 3615, 3298
®
is an ST
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