C8051F337-GM Silicon Laboratories Inc, C8051F337-GM Datasheet - Page 24
![IC MCU 16K FLASH 20QFN](/photos/12/16/121628/c8051f337-gm_sml.jpg)
C8051F337-GM
Manufacturer Part Number
C8051F337-GM
Description
IC MCU 16K FLASH 20QFN
Manufacturer
Silicon Laboratories Inc
Series
C8051F33xr
Specifications of C8051F337-GM
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
17
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-QFN
Processor Series
C8051F3x
Core
8051
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
17
Number Of Timers
4
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
KSK-SL-TOOLSTICK, PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F336DK
Minimum Operating Temperature
- 40 C
For Use With
336-1451 - ADAPTER PROGRAM TOOLSTICK F330
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Details
Other names
336-1428-5
- Current page: 24 of 226
- Download datasheet (2Mb)
C8051F336/7/8/9
24
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
6. The stencil thickness should be 0.125mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
8. A 2x2 array of 0.95mm openings on a 1.1mm pitch should be used for the center pad to
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for
C1
C2
X1
E
mask and the metal pad is to be 60μm minimum, all the way around the pad.
to assure good solder paste release.
assure the proper paste volume (71% Paste Coverage).
Small Body Components.
Figure 4.2. QFN-20 Recommended PCB Land Pattern
Table 4.2. QFN-20 PCB Land Pattern Dimesions
0.20
Min
3.70
3.70
0.50
0.30
Max
Rev.1.0
Dimension
X2
Y1
Y2
2.15
0.90
2.15
Min
Max
2.25
1.00
2.25
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