PIC16F610-I/SL Microchip Technology, PIC16F610-I/SL Datasheet - Page 170

• Manufacturer Part Number: PIC16F610-I/SL
• Description: IC PIC MCU FLASH 1KX14 14SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F610-I/SL

• Program Memory Type: FLASH
• Program Memory Size: 1.75KB (1K x 14)
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 11
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Interface Type: RS-232 / USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 11
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162083 - HEADER MPLAB ICD2 PIC16F616 8/14
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16F610/616/16HV610/616
TABLE 15-15: DC CHARACTERISTICS FOR I
TABLE 15-16: WATCHDOG TIMER SPECIFICATIONS FOR PIC16F616 – H (High Temp.)
TABLE 15-17: LEAKAGE CURRENT SPECIFICATIONS FOR PIC16F616 – H (High Temp.)
DS41288F-page 170
D020E
D021E
D022E
D023E
D024E
D025E
D026E
D027E
31
D061
D062
Note 1:
Param
Param
Param
No.
No.
No.
2:
T
I
I
IL
IL
Sym
WDT
Sym
This specification applies when GP3/RA3/MCLR is configured as an input with the pull-up disabled. The
leakage current for the GP3/RA3/MCLR pin is higher than for the standard I/O port pins.
This specification applies when GP3/RA3/MCLR is configured as the MCLR Reset pin function with the
weak pull-up enabled.
Power Down I
Characteristics
Device
Watchdog Timer Time-out Period
(No Prescaler)
Input Leakage Current
(GP3/RA3/MCLR)
Input Leakage Current
(GP3/RA3/MCLR)
PD
Characteristic
Characteristic
Units
μA
μA
μA
μA
μA
μA
μA
μA
μA
(1)
(2)
Min
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
PD
0.05
0.15
0.35
Typ
105
110
116
0.5
2.5
9.5
5.0
6.0
5.5
7.0
8.5
0.2
0.3
50
55
60
30
45
75
39
59
98
Units
Units
ms
SPECIFICATIONS FOR PIC16F616 – H (High Temp.)
µA
µA
Max
195
210
220
105
125
142
190
110
114
12
13
14
20
25
36
28
36
58
85
76
30
35
45
12
15
Min
Min
—
50
6
±0.5
Typ
Typ
250
20
V
2.0
3.0
5.0
2.0
3.0
5.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
3.0
5.0
DD
Max
Max
±5.0
400
70
I
WDT Current
BOR Current
I
Comparators Enabled)
I
Enabled)
I
I
I
I
© 2009 Microchip Technology Inc.
PD
PD
PD
PD
PD
PD
PD
Condition
Base
Current (Both
Current (One Comparator
(C
(C
(T1 OSC, 32 kHz)
(A2D on, not converting)
150°C Temperature
V
V
VREF
VREF
SS
DD
≤ V
= 5.0V
, High Range)
, Low Range)
Conditions
Conditions
Note
PIN
≤ V
DD