PIC16F636-I/P Microchip Technology, PIC16F636-I/P Datasheet - Page 164
![IC MCU FLASH 2KX14 14DIP](/photos/6/59/65935/150-14-dip_sml.jpg)
PIC16F636-I/P
Manufacturer Part Number
PIC16F636-I/P
Description
IC MCU FLASH 2KX14 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC12F635-ISN.pdf
(234 pages)
3.PIC16F636-ISL.pdf
(8 pages)
4.PIC16F636-ISL.pdf
(4 pages)
5.PIC16F636-IST.pdf
(196 pages)
Specifications of PIC16F636-I/P
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
14-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, LVD, POR, WDT
Number Of I /o
11
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
RS- 232/SPI/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164039 - MODULE SKT PROMATE II 20DIP/SOICAC162057 - MPLAB ICD 2 HEADER 14DIPACICE0207 - MPLABICE 14P 300 MIL ADAPTER
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC12F635-ISN PDF datasheet #2
- PIC16F636-ISL PDF datasheet #3
- PIC16F636-ISL PDF datasheet #4
- PIC16F636-IST PDF datasheet #5
- Current page: 164 of 196
- Download datasheet (4Mb)
PIC12F635/PIC16F636/639
15.10 AC Characteristics: PIC12F635/PIC16F636/639 (Industrial, Extended)
FIGURE 15-4:
TABLE 15-1:
DS41232B-page 162
1
2
3
4
Note 1:
Param
No.
CLKOUT
OSC1
*
† Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
F
T
T
TosL,
TosH
TosR,
TosF
OSC
CY
Sym
OSC
These parameters are characterized but not tested.
only and are not tested.
Instruction cycle period (T
are based on characterization data for that particular oscillator type under standard operating conditions
with the device executing code. Exceeding these specified limits may result in an unstable oscillator
operation and/or higher than expected current consumption. All devices are tested to operate at ‘min’
values with an external clock applied to OSC1 pin. When an external clock input is used, the ‘max’ cycle
time limit is ‘DC’ (no clock) for all devices.
External CLKIN Frequency
Oscillator Frequency
External CLKIN Period
Oscillator Period
Instruction Cycle Time
External CLKIN (OSC1) High
External CLKIN Low
External CLKIN Rise
External CLKIN Fall
EXTERNAL CLOCK TIMING REQUIREMENTS
EXTERNAL CLOCK TIMING
Q4
Characteristic
(1)
CY
(1)
(1)
) equals four times the input oscillator time base period. All specified values
Q1
(1)
1
(1)
100*
Min
250
250
250
200
20*
DC
DC
DC
DC
DC
0.1
27
50
50
27
50
—
—
—
—
—
2*
5
1
Preliminary
Q2
Typ†
125
T
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
CY
2
10,000
1,000
Max
200
50*
25*
15*
DC
3
37
20
20
37
20
—
—
—
—
—
—
—
—
—
—
4
4
4
Q3
Units
MHz XT Oscillator mode
MHz HS Oscillator mode
MHz EC Oscillator mode
MHz HFINTOSC Oscillator mode
MHz RC Oscillator mode
MHz XT Oscillator mode
MHz HS Oscillator mode
3
kHz
kHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
s
s
s
LP Oscillator mode
LP Oscillator mode
LP Oscillator mode
HS Oscillator mode
EC Oscillator mode
XT Oscillator mode
LP Oscillator mode
INTOSC Oscillator mode
RC Oscillator mode
XT Oscillator mode
HS Oscillator mode
T
LP oscillator, T
HS oscillator, T
XT oscillator, T
LP oscillator
XT oscillator
HS oscillator
CY
Q4
4
= 4/F
© 2005 Microchip Technology Inc.
OSC
4
Conditions
OSC
OSC
OSC
Q1
L/H duty cycle
L/H duty cycle
L/H duty cycle
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