PIC16F628-04I/SO Microchip Technology, PIC16F628-04I/SO Datasheet - Page 162
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PIC16F628-04I/SO
Manufacturer Part Number
PIC16F628-04I/SO
Description
IC MCU FLASH 2KX14 COMP 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheet
1.PIC16F627-04P.pdf
(170 pages)
Specifications of PIC16F628-04I/SO
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
18-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Eeprom Size
128 x 8
Ram Size
224 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
224 B
Interface Type
SCI/USART
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
16
Number Of Timers
3
Operating Supply Voltage
3 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
Data Rom Size
128 B
Height
2.31 mm
Length
11.53 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
3 V
Width
7.49 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILAC164010 - MODULE SKT PROMATEII DIP/SOIC
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
PIC16F628-04I/SOR
PIC16F628-04I/SOR
PIC16F628-04I/SOR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F628-04I/SO
Manufacturer:
MIC
Quantity:
20 000
PIC16F62X
K04-072 20-Lead Plastic Shrink Small Outline (SS) – 5.30 mm
DS40300C-page 160
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-150
Drawing No. C04-072
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Foot Angle
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
n
p
β
Dimension Limits
E1
E
Units
A2
A1
E1
E
D
B
n
p
A
L
c
α
φ
β
Preliminary
MIN
2
1
.068
.064
.002
.299
.278
.022
.004
.010
.201
0
0
0
D
φ
L
INCHES*
NOM
.026
.073
.068
.006
.309
.207
.284
.030
.007
.013
20
A1
4
5
5
A
MAX
.078
.072
.010
.322
.212
.289
.037
.010
.015
10
10
8
MIN
1.73
1.63
0.05
7.59
7.06
0.56
0.10
0.00
0.25
5.11
0
0
MILLIMETERS
2003 Microchip Technology Inc.
NOM
101.60
1.85
0.15
7.85
5.25
0.75
0.65
1.73
7.20
0.18
0.32
20
5
5
MAX
203.20
A2
1.98
1.83
0.25
8.18
5.38
7.34
0.94
0.25
0.38
α
10
10