PIC18LF2321-I/SS Microchip Technology, PIC18LF2321-I/SS Datasheet - Page 371
PIC18LF2321-I/SS
Manufacturer Part Number
PIC18LF2321-I/SS
Description
IC PIC MCU FLASH 4KX16 28SSOP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F2221-ISO.pdf
(402 pages)
3.PIC18F2221-ISO.pdf
(8 pages)
4.PIC18F2221-ISO.pdf
(30 pages)
5.PIC18F2221-ISO.pdf
(46 pages)
6.PIC18F2321-IML.pdf
(396 pages)
Specifications of PIC18LF2321-I/SS
Core Size
8-Bit
Program Memory Size
8KB (4K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SSOP
Controller Family/series
PIC18
No. Of I/o's
25
Eeprom Memory Size
256Byte
Ram Memory Size
512Byte
Cpu Speed
40MHz
No. Of Timers
4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC18F2221-ISO PDF datasheet #2
- PIC18F2221-ISO PDF datasheet #3
- PIC18F2221-ISO PDF datasheet #4
- PIC18F2221-ISO PDF datasheet #5
- PIC18F2321-IML PDF datasheet #6
- Current page: 371 of 396
- Download datasheet (7Mb)
28-Lead Skinny Plastic Dual In-Line (SP or PJ) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
© 2007 Microchip Technology Inc.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
2
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
3
b
b1
D
Dimension Limits
Preliminary
Units
A2
A1
E1
b1
eB
N
A
E
D
e
L
b
c
e
PIC18F4321 FAMILY
1.345
.120
.015
.290
.240
.008
.040
.014
A2
MIN
.110
E1
–
–
L
.100 BSC
INCHES
1.365
NOM
.135
.310
.285
.130
.010
.050
.018
28
–
–
–
Microchip Technology Drawing C04-070B
eB
E
1.400
MAX
.200
.150
.335
.295
.150
.015
.070
.022
.430
–
DS39689E-page 369
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