PIC24HJ12GP202-I/ML Microchip Technology, PIC24HJ12GP202-I/ML Datasheet - Page 190

IC PIC MCU FLASH 4KX24 28QFN

PIC24HJ12GP202-I/ML

Manufacturer Part Number
PIC24HJ12GP202-I/ML
Description
IC PIC MCU FLASH 4KX24 28QFN
Manufacturer
Microchip Technology
Series
PIC® 24Hr

Specifications of PIC24HJ12GP202-I/ML

Core Size
16-Bit
Program Memory Size
12KB (4K x 24)
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Core Processor
PIC
Speed
40 MIPs
Connectivity
I²C, SPI, UART/USART
Number Of I /o
21
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Controller Family/series
PIC24
No. Of I/o's
21
Ram Memory Size
1KB
Cpu Speed
40MIPS
No. Of Timers
4
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
1024 B
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Number Of Timers
3
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel / 12 bit, 10 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164336 - MODULE SOCKET FOR PM3 28/44QFNDV164033 - KIT START EXPLORER 16 MPLAB ICD2
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC24HJ12GP202-I/ML
Manufacturer:
MICROCHIP
Quantity:
720
PIC24HJ12GP201/202
TABLE 22-7:
TABLE 22-8:
DS70282D-page 188
DC CHARACTERISTICS
Power-Down Current (I
DC60d
DC60a
DC60b
DC60c
DC61d
DC61a
DC61b
DC61c
Note 1:
DC CHARACTERISTICS
Note 1:
Parameter
Parameter No.
No.
DC73a
DC73g
DC70a
DC70g
DC71a
DC71g
DC72a
DC72g
DC73f
DC70f
DC71f
DC72f
2:
3:
4:
5:
2:
Data in the Typical column is at 3.3V, 25°C unless otherwise stated.
Base I
pulled to V
The Δ current is the additional current consumed when the module is enabled. This current should be
added to the base I
These currents are measured on the device containing the most memory in this family.
These parameters are characterized, but are not tested in manufacturing.
Data in the Typical column is at 3.3V, 25°C unless otherwise stated.
Parameters with DOZE ratios of 1:2 and 1:64 are characterized, but are not tested in manufacturing.
Typical
DC CHARACTERISTICS: POWER-DOWN CURRENT (I
PD
DC CHARACTERISTICS: DOZE CURRENT (I
146
55
63
85
10
12
13
8
is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
SS
Typical
(1)
, WDT, etc., are all switched off, and VREGS (RCON<8>) = 1.
PD
11
11
11
11
11
11
12
12
12
12
12
12
)
(2)
PD
(1)
1000
Max
500
500
500
13
15
20
25
current.
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Max
35
30
30
50
30
30
50
30
30
50
30
30
Units
μA
μA
μA
μA
μA
μA
μA
μA
Preliminary
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Ratio
+125°C
+125°C
1:128
1:128
1:128
1:128
Doze
+25°C
+85°C
+25°C
+85°C
-40°C
-40°C
1:64
1:64
1:64
1:64
1:2
1:2
1:2
1:2
(2)
-40°C ≤ T
-40°C ≤ T
Units
DOZE
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
3.3V
3.3V
)
A
A
≤ +85°C for Industrial
≤ +125°C for Extended
+125°C
+25°C
+85°C
-40°C
Conditions
-40°C ≤ T
-40°C ≤ T
Base Power-Down Current
Watchdog Timer Current: ΔI
PD
)
© 2009 Microchip Technology Inc.
3.3V
3.3V
3.3V
3.3V
A
A
≤ +85°C for Industrial
≤ +125°C for Extended
Conditions
40 MIPS
40 MIPS
40 MIPS
40 MIPS
(3,4)
WDT
(3,5)

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