PIC24HJ32GP202-I/MM Microchip Technology, PIC24HJ32GP202-I/MM Datasheet - Page 15
![IC PIC MCU FLASH 32K 28QFN](/photos/6/81/68120/150-28-qfn_sml.jpg)
PIC24HJ32GP202-I/MM
Manufacturer Part Number
PIC24HJ32GP202-I/MM
Description
IC PIC MCU FLASH 32K 28QFN
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.PIC24HJ32GP202-ISO.pdf
(272 pages)
3.PIC24HJ32GP202-ISO.pdf
(8 pages)
4.PIC24HJ32GP202-ISO.pdf
(12 pages)
5.PIC24HJ32GP204-IML.pdf
(244 pages)
Specifications of PIC24HJ32GP202-I/MM
Program Memory Type
FLASH
Program Memory Size
32KB (11K x 24)
Package / Case
28-QFN
Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
2 KB
Interface Type
I2C/SPI/UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM300027
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 12-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC24HJ12GP201-ISO PDF datasheet
- PIC24HJ32GP202-ISO PDF datasheet #2
- PIC24HJ32GP202-ISO PDF datasheet #3
- PIC24HJ32GP202-ISO PDF datasheet #4
- PIC24HJ32GP204-IML PDF datasheet #5
- Current page: 15 of 272
- Download datasheet (4Mb)
2.0
2.1
Getting started with the PIC24HJ32GP202/204 and
PIC24HJ16GP304 family of 16-bit microcontrollers
requires attention to a minimal set of device pin
connections before proceeding with development. The
following is a list of pin names, which must always be
connected:
• All V
• All AV
• V
• MCLR pin
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
Additionally, the following pins may be required:
• V
© 2011 Microchip Technology Inc.
(see
used)
(see
(see
Connection (V
(see
Programming™ (ICSP™) and debugging purposes
(see
source is used
(see
reference for ADC module is implemented
Note:
Note 1: This data sheet summarizes the features
REF
CAP
DD
Section 2.2 “Decoupling
Section 2.2 “Decoupling
Section 2.3 “CPU Logic Filter Capacitor
Section 2.4 “Master Clear (MCLR)
Section 2.5 “ICSP
Section 2.6 “External Oscillator
+/V
DD
2: Some registers and associated bits
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
MICROCONTROLLERS
Basic Connection Requirements
and V
REF
PIC24HJ32GP202/204 AND PIC24HJ16GP304
and AV
The AV
connected independent of the ADC
voltage reference source.
of
PIC24HJ16GP304 family of devices. It is
not intended to be a comprehensive ref-
erence source. To complement the infor-
mation in this data sheet, refer to the
“dsPIC33F/PIC24H Family Reference
Manual”, which is available from the
Microchip website (www.microchip.com).
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
this data sheet for device-specific register
and bit information.
- pins used when external voltage
SS
the
CAP
SS
pins
DD
)”)
pins (even if ADC module is not
PIC24HJ32GP202/204
and AV
Pins”)
SS
Capacitors”)
Capacitors”)
pins must be
Pins”)
Pin”)
and
in
2.2
The use of decoupling capacitors on every pair of
power supply pins, such as V
AV
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
• Placement on the printed circuit board: The
• Handling high frequency noise: If the board is
• Maximizing performance: On the board layout
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have a resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the microcontroller. If space is con-
stricted, the capacitor can be placed on another
layer on the PCB using a via; however, ensure
that the trace length from the pin to the capacitor
is within one-quarter inch (6 mm) in length.
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the microcontroller pins. This ensures
that the decoupling capacitors are first in the
power chain. Equally important is to keep the
trace length between the capacitor and the power
pins to a minimum thereby reducing PCB track
inductance.
SS
is required.
Decoupling Capacitors
DD
, V
DS70289G-page 15
SS
, AV
DD
and
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