PIC24HJ32GP304-I/ML Microchip Technology, PIC24HJ32GP304-I/ML Datasheet - Page 340
![IC PIC MCU FLASH 32K 44-QFN](/photos/6/81/68122/150-44-qfn_sml.jpg)
PIC24HJ32GP304-I/ML
Manufacturer Part Number
PIC24HJ32GP304-I/ML
Description
IC PIC MCU FLASH 32K 44-QFN
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.PIC24HJ32GP302-ISO.pdf
(368 pages)
3.PIC24HJ32GP302-ISO.pdf
(8 pages)
4.PIC24HJ32GP302-ISO.pdf
(12 pages)
5.PIC24HJ32GP304-EML.pdf
(356 pages)
Specifications of PIC24HJ32GP304-I/ML
Program Memory Type
FLASH
Program Memory Size
32KB (11K x 24)
Package / Case
44-QFN
Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, PMP, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
35
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 13x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
4 KB
Interface Type
I2C/SPI/UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
35
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001
Minimum Operating Temperature
- 40 C
On-chip Adc
13-ch x 10-bit or 13-ch x 12-bit
Controller Family/series
PIC24
No. Of I/o's
35
Ram Memory Size
4KB
Cpu Speed
40MIPS
No. Of Timers
7
Embedded Interface Type
I2C, SPI, UART
Rohs Compliant
Yes
Height
0.88 mm
Length
8 mm
Supply Voltage (max)
3.6 V, 3.9 V
Supply Voltage (min)
2.7 V, 3 V
Width
8 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1004 - PIC24 BREAKOUT BOARDDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC24HJ12GP201-ISO PDF datasheet
- PIC24HJ32GP302-ISO PDF datasheet #2
- PIC24HJ32GP302-ISO PDF datasheet #3
- PIC24HJ32GP302-ISO PDF datasheet #4
- PIC24HJ32GP304-EML PDF datasheet #5
- Current page: 340 of 356
- Download datasheet (6Mb)
DS70293D-page 340
44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
NOTE 1
e
b
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
1 2 3
D
D1
Dimension Limits
Preliminary
E1
Units
L
A2
A1
E1
D1
L1
N
A
E
D
e
L
b
NOTE 2
c
E
A1
A
0.95
0.05
0.45
0.09
0.30
MIN
11°
11°
0°
–
MILLIMETERS
L1
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.80 BSC
1.00 REF
NOM
1.00
0.60
0.37
3.5°
12°
12°
44
–
–
–
Microchip Technology Drawing C04-076B
© 2009 Microchip Technology Inc.
MAX
1.20
1.05
0.15
0.75
0.20
0.45
13°
13°
7°
A2
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