ATMEGA2561-16MU Atmel, ATMEGA2561-16MU Datasheet - Page 30

IC AVR MCU 256K 16MHZ 64-QFN

ATMEGA2561-16MU

Manufacturer Part Number
ATMEGA2561-16MU
Description
IC AVR MCU 256K 16MHZ 64-QFN
Manufacturer
Atmel
Series
AVR® ATmegar
Datasheets

Specifications of ATMEGA2561-16MU

Core Processor
AVR
Core Size
8-Bit
Speed
16MHz
Connectivity
EBI/EMI, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
54
Program Memory Size
256KB (128K x 16)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-MLF®, 64-QFN
Processor Series
ATMEGA256x
Core
AVR8
Data Bus Width
8 bit
Data Ram Size
8 KB
Interface Type
2-Wire, SPI, USART
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
54
Number Of Timers
6
Operating Supply Voltage
2.7 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR, EWAVR-BL
Development Tools By Supplier
ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT, ATAVRRZ541, ATAVRRAVEN, ATAVRRZUSBSTICK, ATAVRRZ201
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Cpu Family
ATmega
Device Core
AVR
Device Core Size
8b
Frequency (max)
16MHz
Total Internal Ram Size
8KB
# I/os (max)
54
Number Of Timers - General Purpose
6
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
4.5V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
64
Package Type
QFN EP
For Use With
ATSTK600-TQFP64 - STK600 SOCKET/ADAPTER 64-TQFP770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAGATAVRISP2 - PROGRAMMER AVR IN SYSTEM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATMEGA2561-16MU
Manufacturer:
MICRON
Quantity:
1
10.4
10.5
10.6
10.7
10.8
2549MS–AVR–09/10
ATmega2560 rev. E
ATmega2560 rev. D
ATmega2560 rev. C
ATmega2560 rev. B
ATmega2560 rev. A
2. High current consumption in sleep mode
1. High current consumption in sleep mode
1.
2. Part does not work under 2.4 volts
High current consumption in sleep mode.
Non-Read-While-Write area of flash not functional.
Part does not work under 2.4 volts.
Incorrect ADC reading in differential mode.
Internal ADC reference has too low value.
IN/OUT instructions may be executed twice when Stack is in external RAM.
EEPROM read from application code does not work in Lock Bit Mode 3.
If a pending interrupt cannot wake the part up from the selected sleep mode, the current
consumption will increase during sleep when executing the SLEEP instruction directly after
a SEI instruction.
Problem Fix/Workaround
Before entering sleep, interrupts not used to wake the part from the sleep mode should be
disabled.
No known errata.
Not sampled.
If a pending interrupt cannot wake the part up from the selected sleep mode, the current
consumption will increase during sleep when executing the SLEEP instruction directly after
a SEI instruction.
Problem Fix/Workaround
Before entering sleep, interrupts not used to wake the part from the sleep mode should be
disabled.
Not sampled.
The Non-Read-While-Write area of the flash is not working as expected. The problem is
related to the speed of the part when reading the flash of this area.
Problem Fix/Workaround
- Only use the first 248K of the flash.
- If boot functionality is needed, run the code in the Non-Read-While-Write area at maximum
1/4th of the maximum frequency of the device at any given voltage. This is done by writing
the CLKPR register before entering the boot section of the code.
The part does not execute code correctly below 2.4 volts.
Non-Read-While-Write area of flash not functional
ATmega640/1280/1281/2560/2561
30

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