C8051T603-GM Silicon Laboratories Inc, C8051T603-GM Datasheet - Page 23

• Manufacturer Part Number: C8051T603-GM
• Description: IC 8051 MCU 4K-EEPROM 11-QFN
• Manufacturer: Silicon Laboratories Inc
• Series: C8051T60xr

Specifications of C8051T603-GM

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SMBus (2-Wire/I²C), UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 8
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: OTP
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 11-QFN
• Processor Series: C8051T6x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C, SMBus, UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 8
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051T600DK
• Minimum Operating Temperature: - 40 C
• For Use With: 336-1404 - KIT DEV FOR C8051T60X MCU'S
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details
• Other names: 336-1656-5

Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
7. A 3 x 1 array of 1.30 x 0.60 mm openings on 0.80 mm pitch should be used for the center
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for
mask and the metal pad is to be 60 m minimum, all the way around the pad.
to assure good solder paste release.
pad.
Small Body Components.
C1
C2
X1
E
Table 4.2. QFN-11 PCB Land Pattern Dimensions
Figure 4.2. QFN-11 PCB Land Pattern
2.75
2.75
0.20
Min
0.50 BSC
Max
2.85
2.85
0.30
Rev. 1.2
Dimension
C8051T600/1/2/3/4/5/6
X2
Y1
Y2
1.40
0.65
2.30
Min
Max
1.50
0.75
2.40
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