PIC10F200-E/MC Microchip Technology, PIC10F200-E/MC Datasheet - Page 4
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PIC10F200-E/MC
Manufacturer Part Number
PIC10F200-E/MC
Description
IC PIC MCU FLASH 256X12 8DFN
Manufacturer
Microchip Technology
Series
PIC® 10Fr
Datasheets
1.PIC10F200T-IOT.pdf
(96 pages)
2.PIC10F200T-IOT.pdf
(6 pages)
3.PIC10F200T-IOT.pdf
(18 pages)
Specifications of PIC10F200-E/MC
Program Memory Type
FLASH
Program Memory Size
384B (256 x 12)
Package / Case
8-DFN
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
3
Ram Size
16 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC10F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
16 B
Interface Type
USB
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
4
Number Of Timers
1
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164334 - MODULE SOCKET FOR 8L 2X3MM DFNAC163020-2 - ADAPTER PROGRAM PIC10F 2X3 DFN
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC10F200-E/MC
Manufacturer:
MICROCHIP
Quantity:
1 000
PIC10F200/202/204/206
APPENDIX A:
Rev A Document (6/2004)
First revision of this document.
Rev B Document (6/2004)
Added Module 2, V
Rev C Document (9/2004)
Added Module 3, MPLAB IDE and the _CONFIG
assembly directive.
Rev D Document (6/2006)
Added the following Modules to the “Clarifications/
Corrections to the Data Sheet” section:
• Module 1,
• Module 2, “Voltage Reference”
• Module 3, “8-Lead 2x3 DFN (MC) Packaging”
• Module 4, “8-Lead 2x3 DFN (MC) Package – Top
• Module 5, “6-Lead SOT-23 (OT) Package – Top
Rev E Document (3/2007)
Revised Module 1 and Module 2 work arounds.
Clarification/Corrections to the Data Sheet:
Revised Module 3: Replaced DFN Package Drawing;
Added Module 6, “Timer0 Clock”;
Added Module 7, Special Features of the CPU,
Register 9-1.
Rev F Document (5/2007)
Revised Module 3, Table 1, Note 1.
Clarification/Corrections to the Data Sheet:
Data Sheet was updated. The following was removed:
• Module 1,
• Module 2, “Voltage Reference”
• Module 3, “8-Lead 2x3 DFN (MC) Packaging”
• Module 4, “8-Lead 2x3 DFN (MC) Package – Top
• Module 5, “6-Lead SOT-23 (OT) Package – Top
• Module 6, “Timer0 Clock”;
Module 7, Special Features of the CPU, Register 9-1 is
renumbered to Module 1.
Rev G Document (6/2007)
Moved Module 3 to Module 4.
Added Module 3: I
DS80194G-page 4
Marking”
Marking”
Marking”
Marking”
“
“
Internal Oscillator”
Internal Oscillator”
PD
REF
, Power-Down Base current
REVISION HISTORY
is disabled in Sleep.
© 2007 Microchip Technology Inc.