PIC12F615-E/SN Microchip Technology, PIC12F615-E/SN Datasheet - Page 154
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC12F615-E/SN
Manufacturer Part Number
PIC12F615-E/SN
Description
IC PIC MCU FLASH 1KX14 8SOIC
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F609T-ISN.pdf
(212 pages)
2.PIC12F609T-ISN.pdf
(26 pages)
3.PIC12F609T-ISN.pdf
(8 pages)
4.PIC12F615-ESN.pdf
(168 pages)
Specifications of PIC12F615-E/SN
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
8-SOIC (3.9mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
5
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS-232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
5
Number Of Timers
3
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
4-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
APGRD004 - REF DESIGN MOD AUTO AMBNT LIGHTAC162083 - HEADER MPLAB ICD2 PIC16F616 8/14
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
- PIC12F609T-ISN PDF datasheet
- PIC12F609T-ISN PDF datasheet #2
- PIC12F609T-ISN PDF datasheet #3
- PIC12F615-ESN PDF datasheet #4
- Current page: 154 of 212
- Download datasheet (2Mb)
PIC12F609/615/617/12HV609/615
16.9
DS41302D-page 154
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
Param
No.
2:
*
Thermal Considerations
T
PD
P
P
P
These parameters are characterized but not tested.
I
T
DD
JA
JC
A
DIE
INTERNAL
I
DER
/
O
= Ambient temperature.
Sym
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Die Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C T
Characteristic
A
+125°C
149.5*
84.6*
41.2*
39.9*
211*
150*
Typ
3.0*
60*
44*
39*
9*
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
W
W
W
W
C
8-pin PDIP package
8-pin SOIC package
8-pin MSOP package
8-pin DFN 3x3mm package
8-pin DFN 4x4mm package
8-pin PDIP package
8-pin SOIC package
8-pin MSOP package
8-pin DFN 3x3mm package
8-pin DFN 4x4mm package
PD = P
P
(NOTE 1)
P
V
P
(NOTE 2)
OH
INTERNAL
I
DER
/
O
))
= (I
= PD
INTERNAL
OL
= I
MAX
2010 Microchip Technology Inc.
* V
DD
Conditions
(T
OL
+ P
x V
DIE
) + (I
I
DD
/
O
- T
A
OH
)/
JA
* (V
DD
-
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