PIC12F635-E/P Microchip Technology, PIC12F635-E/P Datasheet - Page 6

• Manufacturer Part Number: PIC12F635-E/P
• Description: IC MCU FLASH 1KX14 8DIP
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F635-E/P

• Core Size: 8-Bit
• Program Memory Size: 1.75KB (1K x 14)
• Core Processor: PIC
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 5
• Program Memory Type: FLASH
• Eeprom Size: 128 x 8
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Controller Family/series: PIC12
• No. Of I/o's: 6
• Eeprom Memory Size: 128Byte
• Ram Memory Size: 64Byte
• Cpu Speed: 20MHz
• No. Of Timers: 2
• Processor Series: PIC12F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Interface Type: RS- 232, SPI, USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 6
• Number Of Timers: 2
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120, DM163029, DV164101, DM163014
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM163029 - BOARD PICDEM FOR MECHATRONICSAC162057 - MPLAB ICD 2 HEADER 14DIPACICE0201 - MPLABICE 8P 300 MIL ADAPTER
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

PIC12F635
APPENDIX A:
Rev A Document (8/2004)
Issue 1 – When OPTION_REG bits, PS<2:0>, are
clear, multiple spurious Resets can occur when the
WDT times out.
Added Clarification/Corrections to the Data Sheet,
Issues 1, 2 and 3 (changed to 8-pin MF saw
singulated packaging).
Rev B Document (11/2004)
Added Module 2, “Data EEPROM Memory” for
PIC12F635 silicon.
Rev C Document (01/2005)
Revised Modules 1 and 2.
Deleted Clarifications/Corrections to the Data Sheet.
Data Sheet has been updated.
Rev D Document (07/2005)
Data Sheet Clarifications/Corrections Section: Added
Module 1: New 4x4 DFN Package added.
Rev E Document (10/2005)
Data
Replaced 8-Lead Plastic Dual Flat No Lead Package
4x4 (DFN).
Rev F Document (02/2006)
Data Sheet Clarifications/Corrections section: Added
Module 2: I/O Pins.
Rev G Document (03/2006)
Data Sheet Clarifications/Corrections section: Added
Module 3: Data EEPROM Memory; Added Module 4:
Electrical Specifications.
Rev H Document (06/14/06)
Added Module 3: “Wake-up Reset”, and Module 4:
“Internal/External Clock Switch Over”.
Rev J Document (04/2007)
Data
Removed Data Sheet Modules per data sheet update.
Rev K Document (09/2009)
Updated the errata to the new format; Added item 1.2,
“Timer0 and WDT Prescaler Assignment Spurious
Reset”; Deleted the “Date Codes” section; Added new
paragraph to Module 1; Other minor corrections.
DS80203K-page 6
Sheet
Sheet
Clarifications/Corrections
Clarifications/Corrections
DOCUMENT
REVISION HISTORY
Section:
section:
© 2009 Microchip Technology Inc.