PIC16F684-E/SL Microchip Technology, PIC16F684-E/SL Datasheet - Page 139
![IC PIC MCU FLASH 2KX14 14SOIC](/photos/6/59/65933/150-14-soic_sml.jpg)
PIC16F684-E/SL
Manufacturer Part Number
PIC16F684-E/SL
Description
IC PIC MCU FLASH 2KX14 14SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F684-ISL.pdf
(4 pages)
4.PIC16F684-ISL.pdf
(192 pages)
5.PIC16F684-ISL.pdf
(6 pages)
6.PIC16F684-IST.pdf
(164 pages)
Specifications of PIC16F684-E/SL
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
12
Eeprom Size
256 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F684-ISL PDF datasheet #3
- PIC16F684-ISL PDF datasheet #4
- PIC16F684-ISL PDF datasheet #5
- PIC16F684-IST PDF datasheet #6
- Current page: 139 of 192
- Download datasheet (4Mb)
15.6
© 2007 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
Param
No.
2:
3:
Thermal Considerations
θ
θ
T
PD
P
P
P
I
T
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (P
DD
A
JA
JC
J
INTERNAL
I
DER
/
O
= Ambient Temperature.
Sym
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C ≤ T
Characteristic
A
≤ +125°C
DER
).
100.4
69.8
85.0
46.3
32.5
31.0
31.7
Typ
150
2.6
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
W
W
W
W
C
14-pin PDIP package
14-pin SOIC package
14-pin TSSOP package
16-pin QFN 4x0.9mm package
14-pin PDIP package
14-pin SOIC package
14-pin TSSOP package
16-pin QFN 4x0.9mm package
For derated power calculations
PD = P
P
(NOTE 1)
P
P
(NOTE 2, 3)
INTERNAL
I
DER
/
O
= Σ (I
= (T
INTERNAL
OL
J
= I
- T
* V
PIC16F684
DD
A
Conditions
)/θ
OL
+ P
x V
) + Σ (I
JA
DD
I
/
O
DS41202F-page 137
OH
* (V
DD
- V
OH
))
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