PIC16F636-E/P Microchip Technology, PIC16F636-E/P Datasheet - Page 221
PIC16F636-E/P
Manufacturer Part Number
PIC16F636-E/P
Description
IC MCU FLASH 2KX14 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC12F635-ISN.pdf
(234 pages)
3.PIC16F636-ISL.pdf
(8 pages)
4.PIC16F636-ISL.pdf
(4 pages)
Specifications of PIC16F636-E/P
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, LVD, POR, WDT
Number Of I /o
11
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
FLASH
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
14-DIP (0.300", 7.62mm)
For Use With
AC164039 - MODULE SKT PROMATE II 20DIP/SOICAC162057 - MPLAB ICD 2 HEADER 14DIPACICE0207 - MPLABICE 14P 300 MIL ADAPTER
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
- PIC16F616T-ISL PDF datasheet
- PIC12F635-ISN PDF datasheet #2
- PIC16F636-ISL PDF datasheet #3
- PIC16F636-ISL PDF datasheet #4
- Current page: 221 of 234
- Download datasheet (4Mb)
© 2007 Microchip Technology Inc.
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
N
1 2
b
D
Dimension Limits
PIC12F635/PIC16F636/639
e
E1
A2
E
Units
c
A2
A1
E1
L1
N
A
E
D
e
L
φ
c
b
L1
0.80
0.05
4.30
4.90
0.45
0.09
0.19
MIN
0°
–
MILLIMETERS
6.40 BSC
0.65 BSC
1.00 REF
NOM
1.00
4.40
5.00
0.60
14
–
–
–
–
–
Microchip Technology Drawing C04-087B
MAX
1.20
1.05
0.15
4.50
5.10
0.75
0.20
0.30
8°
DS41232D-page 219
φ
L
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