PIC16F636-E/ST Microchip Technology, PIC16F636-E/ST Datasheet - Page 219

• Manufacturer Part Number: PIC16F636-E/ST
• Description: IC MCU FLASH 2KX14 14TSSOP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F636-E/ST

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, LVD, POR, WDT
• Number Of I /o: 11
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 14-TSSOP
• For Use With: AC162057 - MPLAB ICD 2 HEADER 14DIP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Connectivity: -

14-Lead Plastic Dual In-Line (P or PD) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
© 2007 Microchip Technology Inc.
NOTE 1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
A
A1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
N
1
2
b
b1
3
D
Dimension Limits
e
PIC12F635/PIC16F636/639
Units
eB
A2
A1
E1
b1
N
A
E
D
e
L
c
b
A2
E1
.115
.015
.290
.240
.735
.115
.008
.045
.014
MIN
–
–
L
.100 BSC
INCHES
NOM
.310
.750
.130
.060
.018
.130
.250
.010
14
–
–
–
Microchip Technology Drawing C04-005B
MAX
.210
.195
.325
.280
.775
.150
.015
.070
.022
.430
eB
–
E
DS41232D-page 217
c