PIC16F676-E/P Microchip Technology, PIC16F676-E/P Datasheet - Page 96
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PIC16F676-E/P
Manufacturer Part Number
PIC16F676-E/P
Description
IC MCU FLASH 1KX14 W/AD 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC12F629T-ISN.pdf
(24 pages)
3.PIC16F630-ISL.pdf
(132 pages)
4.PIC16F630-ISL.pdf
(2 pages)
5.PIC16F630-ISL.pdf
(10 pages)
6.PIC16F676-EP.pdf
(132 pages)
Specifications of PIC16F676-E/P
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
14-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
12
Eeprom Size
128 x 8
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163029 - BOARD PICDEM FOR MECHATRONICS
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC16F630/676
12.9
FIGURE 12-5:
TABLE 12-1:
DS40039F-page 96
Note 1: Instruction cycle period (T
Param
No.
CLKOUT
1
2
3
4
*
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
OSC1
AC CHARACTERISTICS: PIC16F630/676 (INDUSTRIAL, EXTENDED)
based on characterization data for that particular oscillator type under standard operating conditions with the
device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or
higher than expected current consumption. All devices are tested to operate at “min” values with an external
clock applied to OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock)
for all devices.
These parameters are characterized but not tested.
and are not tested.
F
T
T
TosL,
TosH
TosR,
TosF
OSC
CY
Sym
OSC
EXTERNAL CLOCK TIMING REQUIREMENTS
External CLKIN Frequency
Oscillator Frequency
External CLKIN Period
Oscillator Period
Instruction Cycle Time
External CLKIN (OSC1) High
External CLKIN Low
External CLKIN Rise
External CLKIN Fall
EXTERNAL CLOCK TIMING
Q4
Characteristic
CY
(1)
) equals four times the input oscillator time-base period. All specified values are
Q1
(1)
1
(1)
(1)
(1)
100 *
Min
250
250
250
200
20*
DC
DC
DC
DC
DC
0.1
27
50
50
27
50
—
—
2*
—
—
—
5
1
Q2
Typ†
250
T
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
4
CY
2
3
10,000
1,000
Max
200
DC
50*
25*
15*
Q3
37
20
20
37
—
20
—
—
—
—
—
4
4
4
3
Units
MHz XT mode
MHz HS mode
MHz EC mode
MHz INTOSC mode
MHz RC Osc mode
MHz XT Osc mode
MHz HS Osc mode
kHz
kHz
s
ns
ns
ns
s
ns
ns
ns
ns
ns
s
ns
ns
ns
ns
ns
LP Osc mode
LP Osc mode
LP Osc mode
HS Osc mode
EC Osc mode
XT Osc mode
LP Osc mode
INTOSC mode
RC Osc mode
XT Osc mode
HS Osc mode
T
LP oscillator, T
HS oscillator, T
XT oscillator, T
LP oscillator
XT oscillator
HS oscillator
Q4
CY
4
2010 Microchip Technology Inc.
= 4/F
4
OSC
Conditions
OSC
OSC
OSC
Q1
L/H duty cycle
L/H duty cycle
L/H duty cycle