PIC16F684-E/P Microchip Technology, PIC16F684-E/P Datasheet - Page 4

• Manufacturer Part Number: PIC16F684-E/P
• Description: IC PIC MCU FLASH 2KX14 14DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F684-E/P

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 14-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 12
• Eeprom Size: 256 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM163029 - BOARD PICDEM FOR MECHATRONICSACICE0207 - MPLABICE 14P 300 MIL ADAPTER
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16F684
Clarifications/Corrections to the Data
Sheet:
In the Device Data Sheet (41202D), the following
clarifications and corrections should be noted.
N/A.
DS80197E-page 4
REVISION HISTORY
Rev A Document (7/2004)
First revision of this document. Changes made to
Section 11.1.1, “CCP1 Pin Configuration”.
Rev B Document (08/2004)
Issue 1 – When OPTION_REG bits, PS<2:0>, are
clear, multiple spurious Resets can occur when the
WDT times out.
Rev C Document (11/2004)
Added Module 2: “Data EEPROM Memory” for
PIC16F684 silicon.
Rev D Document (7/2005)
Data Sheet Clarifications/Corrections Section: Added
Module 2: New 4x4 QFN Package added.
Rev E Document (7/2006)
Added Module 3: ECCP with Auto-Shutdown (Silicon
Rev. A4 and B2).
Clarifications/Corrections to the Data Sheet: Removed
Items 1 and 2, which have been incorporated into the
data sheet.
© 2006 Microchip Technology Inc.