PIC16F1827-E/ML Microchip Technology, PIC16F1827-E/ML Datasheet - Page 267
![MCU PIC 8BIT 4K FLASH 28-QFN](/photos/6/81/68120/150-28-qfn_sml.jpg)
PIC16F1827-E/ML
Manufacturer Part Number
PIC16F1827-E/ML
Description
MCU PIC 8BIT 4K FLASH 28-QFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheets
1.PIC16F722-ISS.pdf
(8 pages)
2.PIC16F1826-IP.pdf
(406 pages)
3.PIC16F1826-IP.pdf
(12 pages)
4.PIC16F1826-IP.pdf
(8 pages)
5.PIC16F1826-IP.pdf
(40 pages)
Specifications of PIC16F1827-E/ML
Program Memory Type
FLASH
Program Memory Size
7KB (4K x 14)
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Core Processor
PIC
Core Size
8-Bit
Speed
32MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Eeprom Size
256 x 8
Ram Size
384 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
384 B
Interface Type
I2C/SPI/UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
15
Number Of Timers
5
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
12-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
- PIC16F722-ISS PDF datasheet
- PIC16F1826-IP PDF datasheet #2
- PIC16F1826-IP PDF datasheet #3
- PIC16F1826-IP PDF datasheet #4
- PIC16F1826-IP PDF datasheet #5
- Current page: 267 of 406
- Download datasheet (4Mb)
24.6.5
A Repeated Start condition occurs when the RSEN bit
of the SSPxCON2 register is programmed high and the
Master state machine is no longer active. When the
RSEN bit is set, the SCLx pin is asserted low. When the
SCLx pin is sampled low, the Baud Rate Generator is
loaded and begins counting. The SDAx pin is released
(brought high) for one Baud Rate Generator count
(T
SDAx is sampled high, the SCLx pin will be deasserted
(brought high). When SCLx is sampled high, the Baud
Rate Generator is reloaded and begins counting. SDAx
and SCLx must be sampled high for one T
action is then followed by assertion of the SDAx pin
(SDAx = 0) for one T
asserted low. Following this, the RSEN bit of the
FIGURE 24-27:
2010 Microchip Technology Inc.
BRG
). When the Baud Rate Generator times out, if
I
START CONDITION TIMING
2
C MASTER MODE REPEATED
BRG
REPEAT START CONDITION WAVEFORM
SDAx
SCLx
while SCLx is high. SCLx is
Write to SSPxCON2
occurs here
SDAx = 1,
SCLx (no change)
BRG
. This
Preliminary
T
BRG
SDAx = 1,
SCLx = 1
T
BRG
Repeated Start
SSPxCON2 register will be automatically cleared and
the Baud Rate Generator will not be reloaded, leaving
the SDAx pin held low. As soon as a Start condition is
detected on the SDAx and SCLx pins, the S bit of the
SSPxSTAT register will be set. The SSPxIF bit will not
be set until the Baud Rate Generator has timed out.
Sr
Note 1: If RSEN is programmed while any other
T
BRG
PIC16F/LF1826/27
2: A bus collision during the Repeated Start
S bit set by hardware
At completion of Start bit,
hardware clears RSEN bit
Write to SSPxBUF occurs here
event is in progress, it will not take effect.
condition occurs if:
and sets SSPxIF
• SDAx is sampled low when SCLx
• SCLx goes low before SDAx is
T
BRG
goes from low-to-high.
asserted low. This may indicate that
another master is attempting to
transmit a data ‘1’.
1st bit
T
BRG
DS41391C-page 267
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