PIC16F59-I/PT Microchip Technology, PIC16F59-I/PT Datasheet - Page 77

• Manufacturer Part Number: PIC16F59-I/PT
• Description: IC PIC MCU FLASH 2KX12 44TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F59-I/PT

• Core Size: 8-Bit
• Program Memory Size: 3KB (2K x 12)
• Core Processor: PIC
• Speed: 20MHz
• Peripherals: POR, WDT
• Number Of I /o: 32
• Program Memory Type: FLASH
• Ram Size: 134 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-TQFP, 44-VQFP
• Controller Family/series: PIC16F
• No. Of I/o's: 32
• Ram Memory Size: 134Byte
• Cpu Speed: 20MHz
• No. Of Timers: 1
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 134 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 1
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: DV164101, DV164120
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164305 - MODULE SKT FOR PM3 44TQFP
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

© 2007 Microchip Technology Inc.
28-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A
Note:
A1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
1 2 3
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
b
b1
D
Dimension Limits
Units
e
A2
A1
E1
eB
b1
N
D
e
A
E
L
b
c
A2
E1
1.380
.125
.015
.590
.485
.115
.008
.030
.014
MIN
–
–
L
.100 BSC
INCHES
NOM
28
–
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-079B
1.565
MAX
.250
.195
.625
.580
.200
.015
.070
.022
.700
PIC16F5X
–
eB
E
DS41213D-page 75
c