PIC16F631-I/SS Microchip Technology, PIC16F631-I/SS Datasheet - Page 278
![IC PIC MCU FLASH 1KX14 20SSOP](/photos/6/58/65895/150-20-ssop_sml.jpg)
PIC16F631-I/SS
Manufacturer Part Number
PIC16F631-I/SS
Description
IC PIC MCU FLASH 1KX14 20SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F690DM-PCTLHS.pdf
(306 pages)
3.PIC16F677-IP.pdf
(2 pages)
4.PIC16F677-IP.pdf
(16 pages)
5.PIC16F677-ISO.pdf
(294 pages)
Specifications of PIC16F631-I/SS
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
20-SSOP
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
18
Eeprom Size
128 x 8
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
17
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
658-1047-5 - BOARD EVALUATION ACCESSTOUCHXLT20SS1-1 - SOCKET TRANSITION 20DIP 20SSOPXLT20SS-1 - SOCKET TRANSITION 18DIP 20SSOPAC162061 - HEADER INTRFC MPLAB ICD2 20PINAC164307 - MODULE SKT FOR PM3 28SSOP
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F631-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PIC16F690DM-PCTLHS PDF datasheet #2
- PIC16F677-IP PDF datasheet #3
- PIC16F677-IP PDF datasheet #4
- PIC16F677-ISO PDF datasheet #5
- Current page: 278 of 294
- Download datasheet (6Mb)
PIC16F631/677/685/687/689/690
19.2
The following sections give the technical details of the packages.
20-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP)
DS41262C-page 276
Package Details
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-019
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
n
eB
E1
E
Dimension Limits
§
2
1
D
c
Units
A2
E1
B1
eB
A1
A
E
D
B
n
p
L
c
A1
A
MIN
1.025
Preliminary
.140
.115
.015
.295
.240
.120
.008
.055
.014
.310
5
5
INCHES*
B
B1
NOM
20
1.033
.100
.155
.130
.310
.250
.130
.012
.060
.018
.370
10
10
MAX
1.040
.170
.145
.325
.260
.140
.015
.065
.022
.430
15
15
MIN
26.04
3.56
2.92
0.38
7.49
6.10
3.05
0.20
1.40
0.36
7.87
5
5
MILLIMETERS
p
© 2006 Microchip Technology Inc.
NOM
20
26.24
2.54
3.94
3.30
7.87
6.35
3.30
0.29
1.52
0.46
9.40
A2
10
10
L
MAX
26.42
10.92
4.32
3.68
8.26
6.60
3.56
0.38
1.65
0.56
15
15
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