PIC18F26K20T-I/ML Microchip Technology, PIC18F26K20T-I/ML Datasheet - Page 5

• Manufacturer Part Number: PIC18F26K20T-I/ML
• Description: IC PIC MCU FLASH 32KX16 28QFN
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18F26K20T-I/ML

• Core Size: 8-Bit
• Program Memory Size: 64KB (32K x 16)
• Core Processor: PIC
• Speed: 64MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 24
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 3.8K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Controller Family/series: PIC18
• No. Of I/o's: 25
• Eeprom Memory Size: 1024Byte
• Ram Memory Size: 3.84375KB
• Cpu Speed: 64MHz
• No. Of Timers: 4
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 3936 B
• Interface Type: CCP, ECCP, EUSART, I2C, MSSP, SPI
• Maximum Clock Frequency: 64 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 11 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPP
• Lead Free Status / Rohs Status: Details
• Other names: PIC18F26K20T-I/MLTR

12. Module: ADC
 2010 Microchip Technology Inc.
• The potential for failures increases over the life
• The potential for failures is highest at low V
1. Restrict the input voltage to less than 1/2 of the
2. Use manual acquisition time (ACQT<2:0> =
After extended stress the Most Significant bit
(MSb) of the ADC conversion result can become
stuck at ‘0’. Conversions resulting in code 511 or
less are still accurate, but conversions that should
result in codes greater than 511 are instead pinned
at 511.
The potential for failures is a function of several
factors:
Work around
ADC voltage reference so that the expected
result is always a code less than or equal to 511.
000) and put the part to Sleep after each
conversion.
Affected Silicon Revisions
of the part. No failures have ever been seen for
accelerated stress estimated to be equivalent
to 34 years at room temperature. The failure
rate after accelerated stress estimated to be
equivalent to 146 years at room temperature
can be as high as 10% for V
to failure will decrease as the operating
temperature increases.
and decreases as V
B2
X
B3
X
B5
DD
increases.
DD
= 1.8V. The time
DD
13. Module: Interrupt-on-Change
1.
2.
PIC18F26K20/46K20
When any interrupt-on-change is enabled and the
corresponding input is high, then waking from
Sleep by a source other than interrupt-on-change
may cause the RBIF interrupt flag bit to become
set improperly.
Work around
Use the INTx interrupts in lieu of interrupt-on-
change
Or
Store the state of the PORTB inputs before
entering Sleep. Upon waking, if an RBIF is
detected, then compare the PORTB levels with
those stored. If they are the same, then clear
and ignore the RBIF interrupt.
Affected Silicon Revisions
B2
X
B3
X
B5
X
DS80404E-page 5