PIC16LF1936-I/SS Microchip Technology, PIC16LF1936-I/SS Datasheet - Page 24
![IC PIC MCU FLASH 512KX14 28-SSOP](/photos/6/81/68119/150-28-ssop_sml.jpg)
PIC16LF1936-I/SS
Manufacturer Part Number
PIC16LF1936-I/SS
Description
IC PIC MCU FLASH 512KX14 28-SSOP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheets
1.PIC16LF1933-ISS.pdf
(508 pages)
2.PIC16LF1933-ISS.pdf
(46 pages)
3.PIC16LF1934-IML.pdf
(418 pages)
Specifications of PIC16LF1936-I/SS
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-SSOP
Core Processor
PIC
Core Size
8-Bit
Speed
32MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
25
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
EUSART, MI2C, SPI
Maximum Clock Frequency
32 KHz
Number Of Programmable I/os
35
Number Of Timers
5
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 14 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16LF1936-I/SS
Manufacturer:
MICROCHI
Quantity:
20 000
PIC16F193X/LF193X/PIC16F194X/LF194X/
4.3.9
A Load Configuration, Load Data for Program Memory
or Load Data for Data Memory command must be given
before every Begin Programming command. Program-
ming of the addressed memory will begin after this
command is received. To complete the programming,
the End Externally Timed Programming command
must be sent in the specified time window defined by
T
EEPROM, therefore, the device should be erased prior
to executing this command (see
FIGURE 4-9:
4.3.10
This command is required after a Begin Externally
Timed
command must be sent within the time window
specified by T
Programming command is sent.
After sending the End Externally Timed Programming
command, an additional delay (T
sending the next command. This delay is longer than
the delay ordinarily required between other commands
(see
FIGURE 4-10:
DS41397B-page 24
PEXT
Figure
. No internal erase is performed for the data
Programming
ICSPCLK
ICSPDAT
ICSPDAT
BEGIN EXTERNALLY TIMED
PROGRAMMING
END EXTERNALLY TIMED
PROGRAMMING
ICSPCLK
4-10).
PEXT
after the Begin Externally Timed
BEGIN EXTERNALLY TIMED PROGRAMMING
END EXTERNALLY TIMED PROGRAMMING
command
1
0
1
0
Figure
DIS
) is required before
2
is
2
1
0
4-9).
given.
3
3
0
0
This
4
4
1
1
5
5
1
1
Externally timed writes are not supported for
Configuration and Calibration bits. Any externally timed
write to the Configuration or Calibration Word will have
no effect on the targeted word.
6
6
X
X
T
PEXT
T
End Externally Timed Programming
DIS
Command
1
0
1
2
2010 Microchip Technology Inc.
Next Command
X
1
2
3
0
X
3
X