PIC16F887-E/P Microchip Technology, PIC16F887-E/P Datasheet - Page 4

• Manufacturer Part Number: PIC16F887-E/P
• Description: IC PIC MCU FLASH 8KX14 40DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F887-E/P

• Core Size: 8-Bit
• Program Memory Size: 14KB (8K x 14)
• Mfg Application Notes: Intro to Capacitive Sensing Appl Notes Layout and Physical Design Appl Note
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 35
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 14x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 40-DIP (0.600", 15.24mm)
• Controller Family/series: PIC16F
• No. Of I/o's: 35
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 368Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Package: 40PDIP
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 2.5|3.3|5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 35
• Interface Type: I2C/SPI/USART
• On-chip Adc: 14-chx10-bit
• Number Of Timers: 3
• Processor Series: PIC16F
• Core: PIC
• Data Ram Size: 368 B
• Maximum Clock Frequency: 20 MHz
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 53273-916
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164123, DM164120-3, DV164122
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LD
• Lead Free Status / Rohs Status: Details

PIC16F88X
Silicon Errata Issues
1. Module: Low-Voltage In-Circuit Serial
DS80302F-page 4
Note:
If LVP (Low-Voltage Programming) mode is
enabled, programming the device using the V
pin while holding high or toggling the port pin RB3/
PGM during Program mode could disrupt the
programming sequence.
Work around
Pull down pin RB3/PGM using external circuitry
during programming of the device.
Affected Silicon Revisions
PIC16F882
PIC16F883/PIC16F884
PIC16F886/PIC16F887
A0
A0
A2
X
X
X
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated by the shaded column in
the following tables apply to the current
silicon revision (A0 or A2, as applicable).
Programming™ (LVD)
PP
2. Module: MSSP (SPI Mode)
FIGURE 1:
EXAMPLE 1:
LOOP BTFSS SSPSTAT, BF
When the SPI is using Timer2/2 as the clock
source, a shorter than expected SCK pulse may
occur on the first bit of the transmitted/received
data (Figure 1).
Work around
To avoid producing the short pulse, turn off Timer2
and clear the TMR2 register, load the SSPBUF
with the data to transmit and then turn Timer2 back
on. Refer to Example 1 for sample code.
Affected Silicon Revisions
PIC16F882
PIC16F883/PIC16F884
PIC16F886/PIC16F887
A0
A0
A2
SDO
SCK
GOTO
MOVF
MOVWF RXDATA
MOVF
BCF
CLRF
MOVWF SSPBUF
BSF
X
X
X
Write SSPBUF
LOOP
SSPBUF, W
TXDATA, W
T2CON, TMR2ON
TMR2
T2CON, TMR2ON
bit 0 = 1 bit 1 = 0
SCK PULSE VARIATION
USING TIMER2/2
AVOIDING THE INITIAL
SHORT SCK PULSE
© 2009 Microchip Technology Inc.
;Data received?
;(Xmit complete?)
;No
;W = SSPBUF
;Save in user RAM
;W = TXDATA
;Timer2 off
;Clear Timer2
;Xmit New data
;Timer2 on
bit 2 = 1
. . . .