PIC12C672-10I/MF Microchip Technology, PIC12C672-10I/MF Datasheet - Page 116

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PIC12C672-10I/MF

Manufacturer Part Number
PIC12C672-10I/MF
Description
IC MCU OTP 2KX14 A/D 8DFN
Manufacturer
Microchip Technology
Series
PIC® 12Cr
Datasheets

Specifications of PIC12C672-10I/MF

Core Processor
PIC
Core Size
8-Bit
Speed
10MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
OTP
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DFN
For Use With
AC164324 - MODULE SKT FOR MPLAB 8DFN/16QFNXLT08DFN2 - SOCKET TRANSITION ICE 14DIP/8DFNXLT08DFN - SOCKET TRANSITION ICE 8DFNAC164032 - ADAPTER PICSTART PLUS 8DFN/DIPAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Connectivity
-
Other names
PIC12C67210I/MF
PIC12C67X
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS30561B-page 116
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
n
eB
E1
E
Dimension Limits
2
1
Units
A2
E1
B1
eB
A1
A
E
D
B
n
p
L
c
c
D
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
A
A1
.100
.155
.130
.313
.250
.373
.130
.012
.058
.018
.370
10
10
8
B1
B
MAX
.170
.145
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MIN
6.10
9.14
3.18
0.20
1.14
0.36
7.87
3.56
2.92
0.38
7.62
5
5
MILLIMETERS
1999 Microchip Technology Inc.
NOM
2.54
3.94
3.30
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
10
8
p
A2
MAX
10.92
L
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
15
15

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