PIC18LF1320-I/SOG Microchip Technology, PIC18LF1320-I/SOG Datasheet - Page 5
PIC18LF1320-I/SOG
Manufacturer Part Number
PIC18LF1320-I/SOG
Description
IC PIC MCU FLASH 4KX16 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F1220-ISO.pdf
(308 pages)
3.PIC18F1220-ISO.pdf
(8 pages)
4.PIC18F1220-ISO.pdf
(6 pages)
5.PIC18F1220-ISO.pdf
(10 pages)
6.PIC18F1220-ISO.pdf
(4 pages)
Specifications of PIC18LF1320-I/SOG
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
16
Program Memory Size
8KB (4K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 7x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
18-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC18F1220-ISO PDF datasheet #2
- PIC18F1220-ISO PDF datasheet #3
- PIC18F1220-ISO PDF datasheet #4
- PIC18F1220-ISO PDF datasheet #5
- PIC18F1220-ISO PDF datasheet #6
- Current page: 5 of 308
- Download datasheet (5Mb)
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 I/O Ports ..................................................................................................................................................................................... 87
11.0 Timer0 Module ........................................................................................................................................................................... 99
12.0 Timer1 Module ......................................................................................................................................................................... 103
13.0 Timer2 Module ......................................................................................................................................................................... 109
14.0 Timer3 Module ......................................................................................................................................................................... 111
15.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 115
16.0 Enhanced Addressable Universal Synchronous Asynchronous Receiver Transmitter (EUSART) .......................................... 131
17.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 155
18.0 Low-Voltage Detect .................................................................................................................................................................. 165
19.0 Special Features of the CPU.................................................................................................................................................... 171
20.0 Instruction Set Summary .......................................................................................................................................................... 191
21.0 Development Support............................................................................................................................................................... 233
22.0 Electrical Characteristics .......................................................................................................................................................... 237
23.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 267
24.0 Packaging Information.............................................................................................................................................................. 285
Appendix A: Revision History............................................................................................................................................................. 291
Appendix B: Device Differences ........................................................................................................................................................ 291
Appendix C: Conversion Considerations ........................................................................................................................................... 292
Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 292
Appendix E: Migration from Mid-Range to Enhanced Devices .......................................................................................................... 293
Appendix F: Migration from High-End to Enhanced Devices ............................................................................................................. 293
Index .................................................................................................................................................................................................. 295
The Microchip Web Site ..................................................................................................................................................................... 303
Customer Change Notification Service .............................................................................................................................................. 303
Customer Support .............................................................................................................................................................................. 303
Reader Response .............................................................................................................................................................................. 304
PIC18F1220/1320 Product Identification System .............................................................................................................................. 305
© 2007 Microchip Technology Inc.
Device Overview .......................................................................................................................................................................... 5
Oscillator Configurations ............................................................................................................................................................ 11
Power Managed Modes ............................................................................................................................................................. 19
Reset .......................................................................................................................................................................................... 33
Memory Organization ................................................................................................................................................................. 41
Flash Program Memory.............................................................................................................................................................. 57
Data EEPROM Memory ............................................................................................................................................................. 67
8 x 8 Hardware Multiplier............................................................................................................................................................ 71
Interrupts .................................................................................................................................................................................... 73
PIC18F1220/1320
DS39605F-page 3
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