PIC16F914-E/P Microchip Technology, PIC16F914-E/P Datasheet - Page 314

• Manufacturer Part Number: PIC16F914-E/P
• Description: IC PIC MCU FLASH 4KX14 40DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F914-E/P

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
• Number Of I /o: 35
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 40-DIP (0.600", 15.24mm)
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: SSP, I2C, AUSART, SPI
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 35
• Number Of Timers: 2
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120, DM163029
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8
• For Use With: DM163029 - BOARD PICDEM FOR MECHATRONICSDVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PIC16F913/914/916/917/946
DS41250F-page 312
28-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A
A1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Foot Angle
Lead Width
N
1 2
b
D
Dimension Limits
e
E1
Units
A2
A1
E1
L1
N
A
E
D
e
L
c
φ
b
A2
E
1.65
0.05
7.40
5.00
9.90
0.55
0.09
0.22
MIN
c
0°
–
MILLIMETERS
L1
0.65 BSC
1.25 REF
10.20
NOM
1.75
7.80
5.30
0.75
28
4°
–
–
–
–
Microchip Technology Drawing C04-073B
© 2007 Microchip Technology Inc.
10.50
MAX
2.00
1.85
8.20
5.60
0.95
0.25
0.38
8°
–
φ
L