ATTINY26L-8MU Atmel, ATTINY26L-8MU Datasheet - Page 2

• Manufacturer Part Number: ATTINY26L-8MU
• Description: ID MCU AVR 2K 5V 8MHZ 32-QFN
• Manufacturer: Atmel
• Series: AVR® ATtinyr

Specifications of ATTINY26L-8MU

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: USI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Size: 2KB (1K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 128 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-VQFN Exposed Pad, 32-HVQFN, 32-SQFN, 32-DHVQFN
• Processor Series: ATTINY2x
• Core: AVR8
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: 2-Wire, ISP, SM-Bus, SPI, UART, USI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 2
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWAVR, EWAVR-BL
• Development Tools By Supplier: ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 11 Channel
• Cpu Family: ATtiny
• Device Core: AVR
• Device Core Size: 8b
• Frequency (max): 8MHz
• Total Internal Ram Size: 128Byte
• # I/os (max): 16
• Number Of Timers - General Purpose: 2
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 32
• Package Type: MLF EP
• For Use With: ATSTK600 - DEV KIT FOR AVR/AVR32770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAGATAVRISP2 - PROGRAMMER AVR IN SYSTEMATSTK505 - ADAPTER KIT FOR 14PIN AVR MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ATTINY26L-8MJ; ATTINY26L-8MJ

Pin
Configuration
2
ATtiny26(L)
Note:
The bottom pad under the QFN/MLF package should be soldered to ground.
(MOSI/DI/SDA/OC1A) PB0
(ADC7/XTAL1) PB4
(ADC8/XTAL2) PB5
(MISO/DO/OC1A) PB1
(SCK/SCL/OC1B) PB2
(ADC10/RESET) PB7
(ADC9/INT0/T0) PB6
(ADC7/XTAL1) PB4
(ADC8/XTAL2) PB5
(OC1B) PB3
(OC1B) PB3
GND
VCC
NC
NC
NC
GND
VCC
1
2
3
4
5
6
7
8
MLF Top View
1
2
3
4
5
6
7
8
9
10
PDIP/SOIC
20
19
18
17
16
15
14
13
12
11
PA0 (ADC0)
PA1 (ADC1)
PA2 (ADC2)
PA3 (AREF)
GND
AVCC
PA4 (ADC3)
PA5 (ADC4)
PA6 (ADC5/AIN0)
PA7 (ADC6/AIN1)
24
23
22
21
20
19
18
17
NC
PA2 (ADC2)
PA3 (AREF)
GND
NC
NC
AVCC
PA4 (ADC3)
1477KS–AVR–08/10