DSPIC30F2011-20E/ML Microchip Technology, DSPIC30F2011-20E/ML Datasheet - Page 6
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DSPIC30F2011-20E/ML
Manufacturer Part Number
DSPIC30F2011-20E/ML
Description
IC DSPIC MCU/DSP 12K 28QFN
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2011-20ISO.pdf
(210 pages)
3.DSPIC30F2011-20ISO.pdf
(14 pages)
4.DSPIC30F2011-20ISO.pdf
(6 pages)
5.DSPIC30F2011-20ISO.pdf
(18 pages)
6.DSPIC30F2011-20IP.pdf
(26 pages)
Specifications of DSPIC30F2011-20E/ML
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
12
Program Memory Size
12KB (4K x 24)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
For Use With
DAF30-4 - DEVICE ATP FOR ICE4000
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
dsPIC30F2011/2012
10. Module: Sleep Mode
EXAMPLE 5:
DS80273F-page 6
; ----------------------------------------------------------------------------------------------
.global __reset
.global _main
.global _GotoSleep
.global __AddressError
.global __INT1Interrupt
; ----------------------------------------------------------------------------------------------
_main:
_continue:
; ----------------------------------------------------------------------------------------------
; Address Error Trap
__AddressError:
; ----------------------------------------------------------------------------------------------
__INT1Interrupt:
; ----------------------------------------------------------------------------------------------
_GotoSleep:
; fill remainder of the last row with NOP instructions
; Place SLEEP instruction in the last word of program memory
Execution of the Sleep instruction (PWRSAV #0)
may cause incorrect program operation after the
device wakes up from Sleep. The current
consumption during Sleep may also increase
beyond the specifications listed in the device data
sheet.
Work arounds
To avoid this issue, any of the following three work
arounds can be implemented, depending on the
application requirements.
Work around 1:
Ensure that the PWRSAV #0 instruction is located
at the end of the last row of Program Flash
Memory available on the target device and fill the
remainder of the row with NOP instructions.
.section *, code
BSET
BCLR
BSET
CALL
BRA
BCLR
; Set program memory return address to _continue
POP.D
MOV.B
MOV
PUSH.D W0
RETFIE
BCLR
RETFIE
.section *, code, address (0x1FC0)
.rept 31
.endr
PWRSAV #0
NOP
_continue
W0
#tblpage (_continue), W1
#tbloffset (_continue), W0
IFS1, #INT1IF
INTCON2, #INT1EP
IFS1, #INT1IF
IEC1, #INT1IE
_GotoSleep
INTCON1, #ADDRERR
; Set up INT pins to detect falling edge
; Clear interrupt pin interrupt flag bits
; Enable ISR processing for INT pins
; Call function to enter SLEEP mode
; Ensure flag is reset
; Return from Interrupt Service Routine
This can be accomplished by replacing all
occurrences of the PWRSAV #0 instruction with a
function call to a suitably aligned subroutine. The
address( ) attribute provided by the MPLAB
ASM30 assembler can be utilized to correctly align
the instructions in the subroutine. For an
application written in C, the function call would be
GotoSleep( ), while for an assembly language
application,
CALL _GotoSleep.
The address error trap service routine software
can then replace the invalid return address saved
on the stack with the address of the instruction
immediately
GotoSleep( ) function call. This ensures that
the device continues executing the correct code
sequence after waking up from Sleep mode.
Example 5
described above, as it would apply to a
dsPIC30F2011 device.
demonstrates
the
following
© 2008 Microchip Technology Inc.
function
the
the
_GotoSleep
call
work
would
around
be
or