PIC16F72-I/SS Microchip Technology, PIC16F72-I/SS Datasheet - Page 38

IC PIC MCU FLASH 2KX14 28-SSOP

PIC16F72-I/SS

Manufacturer Part Number
PIC16F72-I/SS
Description
IC PIC MCU FLASH 2KX14 28-SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F72-I/SS

Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
28-SSOP
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
I2C/SPI/SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 8-bit
Controller Family/series
PIC16F
No. Of I/o's
22
Ram Memory Size
128Byte
Cpu Speed
20MHz
No. Of Timers
3
Embedded Interface Type
I2C, SPI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164307 - MODULE SKT FOR PM3 28SSOPXLT28SS-1 - SOCKET TRANSITION ICE 28SSOP
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F72-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PICmicro MID-RANGE MCU FAMILY
2.3.3
DS31002A-page 2-8
Tuning the Oscillator Circuit
Since Microchip devices have wide operating ranges (frequency, voltage, and temperature;
depending on the part and version ordered) and external components (crystals, capacitors,...),
of varying quality and manufacture; validation of operation needs to be performed to ensure that
the component selection will comply with the requirements of the application.
There are many factors that go into the selection and arrangement of these external components.
These factors include:
• amplifier gain
• desired frequency
• resonant frequency(s) of the crystal
• temperature of operation
• supply voltage range
• start-up time
• stability
• crystal life
• power consumption
• simplification of the circuit
• use of standard components
• combination which results in fewest components
1997 Microchip Technology Inc.

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