PIC16F72-I/SS Microchip Technology, PIC16F72-I/SS Datasheet - Page 3

• Manufacturer Part Number: PIC16F72-I/SS
• Description: IC PIC MCU FLASH 2KX14 28-SSOP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F72-I/SS

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 28-SSOP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: I2C/SPI/SSP
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5-ch x 8-bit
• Controller Family/series: PIC16F
• No. Of I/o's: 22
• Ram Memory Size: 128Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Embedded Interface Type: I2C, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164307 - MODULE SKT FOR PM3 28SSOPXLT28SS-1 - SOCKET TRANSITION ICE 28SSOP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

4. Module: Package Marking Information
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body (QFN) –
With 0.55 mm Contact Length (Saw Singulated)
© 2005 Microchip Technology Inc.
The package drawing on page 121 of the Device
Data Sheet no longer applies; refer to the package
information below.
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Drawing No. C04-105
A1
*Controlling Parameter
Notes:
JEDEC equivalent: MO-220
TOP VIEW
Dimension Limits
E
Units
D2
A1
A3
E2
n
e
A
E
D
b
L
OPTIONAL
INDEX
AREA
MIN
D
.031
.000
.232
.140
.232
.140
.009
.018
EXPOSED
METAL
INDICATORS
A
ALTERNATE
PAD OUTLINE
.008 REF
PAD
.026 BSC
INCHES
ALTERNATE
NOM
D2
28
INDEX
DETAIL
.035
.001
.236
.146
.236
.146
.011
.022
2
1
The solder mask drawing for the 28-pin QFN
package on page 122 of the Device Data Sheet
has been omitted. This drawing is from older
documentation and no longer applies.
MAX
n
.002
.240
.152
.240
.152
.013
.024
.039
BOTTOM VIEW
SEE DETAIL
E2
MIN
0.80
0.00
5.90
3.55
5.90
3.55
0.23
0.45
MILLIMETERS*
0.65 BSC
0.20 REF
PIC16F72
NOM
28
Revised 02-18-05
L
0.90
0.02
6.00
3.70
6.00
3.70
0.28
0.55
DS80155C-page 3
b
e
MAX
1.00
0.05
6.10
3.85
6.10
3.85
0.33
0.65