PIC16F72-I/SS Microchip Technology, PIC16F72-I/SS Datasheet - Page 124

IC PIC MCU FLASH 2KX14 28-SSOP

PIC16F72-I/SS

Manufacturer Part Number
PIC16F72-I/SS
Description
IC PIC MCU FLASH 2KX14 28-SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F72-I/SS

Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
28-SSOP
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
I2C/SPI/SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 8-bit
Controller Family/series
PIC16F
No. Of I/o's
22
Ram Memory Size
128Byte
Cpu Speed
20MHz
No. Of Timers
3
Embedded Interface Type
I2C, SPI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164307 - MODULE SKT FOR PM3 28SSOPXLT28SS-1 - SOCKET TRANSITION ICE 28SSOP
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F72-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC16F72
28-Lead Plastic Quad Flat No Leads Package (ML) 6x6 mm Body (QFN) (Continued)
DS39597B-page 122
Pitch
Pad Width
Pad Length
Pad to Solder Mask
*Controlling Parameter
Drawing No. C04-2114
SOLDER
MASK
M
Dimension Limits
M
Units
M
p
B
L
MIN
.009
.020
.005
INCHES
.026 BSC
NOM
B
.011
.024
MAX
.014
.030
.006
MIN
0.23
0.50
0.13
MILLIMETERS*
2002 Microchip Technology Inc.
0.65 BSC
NOM
0.28
0.60
PACKAGE
EDGE
L
p
MAX
0.35
0.75
0.15

Related parts for PIC16F72-I/SS