PIC16C55-LPI/SP Microchip Technology, PIC16C55-LPI/SP Datasheet - Page 133
![IC MCU OTP 512X12 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC16C55-LPI/SP
Manufacturer Part Number
PIC16C55-LPI/SP
Description
IC MCU OTP 512X12 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheet
1.PIC16LC58B-04P.pdf
(194 pages)
Specifications of PIC16C55-LPI/SP
Core Processor
PIC
Core Size
8-Bit
Speed
40kHz
Peripherals
POR, WDT
Number Of I /o
20
Program Memory Size
768B (512 x 12)
Program Memory Type
OTP
Ram Size
24 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 6.25 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
For Use With
DVA16XP280 - ADAPTER DEVICE FOR MPLAB-ICE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
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17.0
Absolute Maximum Ratings
Ambient temperature under bias............................................................................................................ –55°C to +125°C
Storage temperature ............................................................................................................................. –65°C to +150°C
Voltage on V
Voltage on MCLR with respect to V
Voltage on all other pins with respect to V
Total power dissipation
Max. current out of V
Max. current into V
Max. current into an input pin (T0CKI only)
Input clamp current, I
Output clamp current, I
Max. output current sunk by any I/O pin .................................................................................................................25 mA
Max. output current sourced by any I/O pin ............................................................................................................20 mA
Max. output current sourced by a single I/O (Port A, B or C) .................................................................................50 mA
Max. output current sunk by a single I/O (Port A, B or C) .......................................................................................50 mA
† NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indi-
cated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1: Power dissipation is calculated as follows: Pdis = V
2002 Microchip Technology Inc.
ELECTRICAL CHARACTERISTICS - PIC16C54C/CR54C/C55A/C56A/CR56A/
C57C/CR57C/C58B/CR58B
DD
with respect to V
DD
SS
IK
pin ......................................................................................................................................100 mA
(1)
OK
(V
pin ...................................................................................................................................150 mA
.....................................................................................................................................800 mW
I
(V
< 0 or V
O
(†)
< 0 or V
SS
SS
I
..................................................................................................................0 to +7.5V
> V
................................................................................................................0 to +14V
O
> V
DD
SS
)
DD
................................................................................. –0.6V to (V
)
Preliminary
DD
x {I
DD
-
I
OH
} +
{(V
DD
-V
PIC16C5X
OH
) x I
DS30453D-page 131
OH
} + (V
DD
OL
+ 0.6V)
500 A
20 mA
20 mA
x I
OL
)
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