PIC16F916-I/SS Microchip Technology, PIC16F916-I/SS Datasheet - Page 310
PIC16F916-I/SS
Manufacturer Part Number
PIC16F916-I/SS
Description
IC PIC MCU FLASH 8KX14 28SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F913-ISS.pdf
(330 pages)
3.PIC16F913-ISS.pdf
(8 pages)
4.PIC16F913-ISS.pdf
(34 pages)
Specifications of PIC16F916-I/SS
Core Size
8-Bit
Program Memory Size
14KB (8K x 14)
Core Processor
PIC
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
24
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
352 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SSOP
Controller Family/series
PIC16F
No. Of I/o's
24
Eeprom Memory Size
256Byte
Ram Memory Size
352Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
352 B
Interface Type
SSP, I2C, AUSART, SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
24
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120
Minimum Operating Temperature
- 40 C
On-chip Adc
5 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MA160011 - DAUGHTER BOARD PICDEM LCD 16F91XAC164307 - MODULE SKT FOR PM3 28SSOPXLT28SS-1 - SOCKET TRANSITION ICE 28SSOP
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F916-I/SS
Manufacturer:
Microchi
Quantity:
204
Company:
Part Number:
PIC16F916-I/SS
Manufacturer:
Cypress
Quantity:
1 466
Part Number:
PIC16F916-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PIC16F913-ISS PDF datasheet #2
- PIC16F913-ISS PDF datasheet #3
- PIC16F913-ISS PDF datasheet #4
- Current page: 310 of 330
- Download datasheet (7Mb)
PIC16F913/914/916/917/946
DS41250F-page 308
40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1 2 3
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
b
b1
D
Dimension Limits
Units
A2
A1
E1
eB
b1
N
D
A
E
e
L
c
b
e
A2
1.980
.125
.015
.590
.485
.115
.008
.030
.014
MIN
E1
–
–
L
.100 BSC
INCHES
NOM
40
–
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-016B
© 2007 Microchip Technology Inc.
eB
E
2.095
MAX
.250
.195
.625
.580
.200
.015
.070
.023
.700
–
c
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