DSPIC33FJ12MC202-I/SS Microchip Technology, DSPIC33FJ12MC202-I/SS Datasheet - Page 259
DSPIC33FJ12MC202-I/SS
Manufacturer Part Number
DSPIC33FJ12MC202-I/SS
Description
IC DSPIC MCU/DSP 12K 28SSOP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.DSPIC33FJ12MC201-ISO.pdf
(288 pages)
3.DSPIC33FJ12MC201-ISO.pdf
(14 pages)
4.DSPIC33FJ12MC202-IML.pdf
(282 pages)
Specifications of DSPIC33FJ12MC202-I/SS
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
12KB (12K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SSOP
Core Frequency
40MHz
Core Supply Voltage
2.75V
Embedded Interface Type
I2C, JTAG, SPI, UART
No. Of I/o's
21
Flash Memory Size
12KB
Supply Voltage Range
3V To 3.6V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC33FJ12MC202-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC24HJ12GP201-ISO PDF datasheet
- DSPIC33FJ12MC201-ISO PDF datasheet #2
- DSPIC33FJ12MC201-ISO PDF datasheet #3
- DSPIC33FJ12MC202-IML PDF datasheet #4
- Current page: 259 of 282
- Download datasheet (4Mb)
24.2
© 2008 Microchip Technology Inc.
20-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
NOTE 1
A
A1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Package Details
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
N
1
2
b
b1
3
D
Dimension Limits
Preliminary
dsPIC33FJ12MC201/202
e
Units
A2
A1
E1
eB
b1
N
D
e
A
E
b
L
c
A2
E1
.015
.300
.240
.980
.008
.045
.014
MIN
.115
.115
–
–
L
.100 BSC
INCHES
1.030
NOM
.130
.310
.250
.130
.010
.060
.018
20
–
–
–
Microchip Technology Drawing C04-019B
1.060
MAX
.210
.195
.325
.280
.150
.015
.070
.022
.430
–
eB
E
DS70265C-page 257
c
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