PIC16C55-HSI/SS Microchip Technology, PIC16C55-HSI/SS Datasheet - Page 81
![IC MCU OTP 512X12 28SSOP](/photos/6/81/68119/150-28-ssop_sml.jpg)
PIC16C55-HSI/SS
Manufacturer Part Number
PIC16C55-HSI/SS
Description
IC MCU OTP 512X12 28SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheet
1.PIC16LC58B-04P.pdf
(194 pages)
Specifications of PIC16C55-HSI/SS
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
20
Program Memory Size
768B (512 x 12)
Program Memory Type
OTP
Ram Size
24 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SSOP
For Use With
309-1026 - ADAPTER 28-SSOP TO 28-DIP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
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13.0
Absolute Maximum Ratings
Ambient Temperature under bias ..................................................................................................... –55°C to +125°C
Storage Temperature ....................................................................................................................... –65°C to +150°C
Voltage on V
Voltage on MCLR with respect to V
Voltage on all other pins with respect to V
Total power dissipation
Max. current out of V
Max. current into V
Max. current into an input pin (T0CKI only)
Input clamp current, I
Output clamp current, I
Max. output current sunk by any I/O pin ........................................................................................................... 25 mA
Max. output current sourced by any I/O pin ...................................................................................................... 20 mA
Max. output current sourced by a single I/O port (PORTA or B) ....................................................................... 40 mA
Max. output current sunk by a single I/O port (PORTA or B) ............................................................................ 50 mA
Note 1: Voltage spikes below Vss at the MCLR pin, inducing currents greater than 80 mA may cause latch-up. Thus,
2002 Microchip Technology Inc.
† NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indi-
cated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
2: Power Dissipation is calculated as follows: P
ELECTRICAL CHARACTERISTICS - PIC16CR54A
a series resistor of 50 to 100
this pin directly to Vss.
DD
with respect to V
DD
SS
IK
pin .................................................................................................................................. 50 mA
(2)
OK
(VI < 0 or VI > V
pin ............................................................................................................................. 150 mA
............................................................................................................................... 800 mW
(V0 < 0 or V0 > V
SS
(
†
)
SS
............................................................................................................ 0 to +7.5V
(1)
DD
...................................................................................................... 0 to +14V
SS
should be used when applying a low level to the MCLR pin rather than pulling
)
DD
............................................................................–0.6V to (V
)
Preliminary
DIS
= V
DD
x {I
DD
-
I
OH
} +
{(V
DD
-V
PIC16C5X
OH
) x I
OH
DS30453D-page 79
} + (V
DD
+ 0.6V)
500 A
20 mA
20 mA
OL
x I
OL
)
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