PIC16C622-04E/P Microchip Technology, PIC16C622-04E/P Datasheet - Page 115
![IC MCU OTP 2KX14 COMP 18DIP](/photos/6/76/67657/18-dip_300mil__sml.jpg)
PIC16C622-04E/P
Manufacturer Part Number
PIC16C622-04E/P
Description
IC MCU OTP 2KX14 COMP 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Specifications of PIC16C622-04E/P
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
13
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
OTP
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
18-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
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14.0
18-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP)
2003 Microchip Technology Inc.
PACKAGING INFORMATION
Number of Pins
Pitch
Top to Seating Plane
Ceramic Package Height
Standoff
Shoulder to Shoulder Width
Ceramic Pkg. Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Window Width
Window Length
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-036
Drawing No. C04-010
W2
n
E1
W1
eB
E
Dimension Limits
§
2
1
Units
W2
W1
A2
E1
eB
D
A1
B1
A
E
D
B
n
p
L
c
c
A1
A
MIN
.170
.155
.015
.300
.285
.880
.125
.008
.050
.016
.345
.130
.190
INCHES*
NOM
.100
.183
.160
.023
.313
.290
.900
.138
.010
.055
.019
.385
.140
.200
18
B
B1
MAX
.195
.165
.030
.325
.295
.920
.150
.012
.060
.425
.150
.210
.021
MIN
22.35
4.32
3.94
0.38
7.62
7.24
3.18
0.20
1.27
8.76
3.30
4.83
0.41
MILLIMETERS
p
PIC16C62X
NOM
22.86
A2
2.54
4.64
4.06
0.57
7.94
7.37
3.49
0.25
1.40
0.47
9.78
3.56
5.08
18
L
MAX
DS30235J-page 113
23.37
10.80
4.95
4.19
0.76
8.26
7.49
0.30
1.52
0.53
5.33
3.81
3.81
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