PIC16LC926-I/PT Microchip Technology, PIC16LC926-I/PT Datasheet - Page 166
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PIC16LC926-I/PT
Manufacturer Part Number
PIC16LC926-I/PT
Description
IC MCU CMOS 20MHZ 8K W/LCD64TQFP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Specifications of PIC16LC926-I/PT
Core Size
8-Bit
Program Memory Size
14KB (8K x 14)
Core Processor
PIC
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
25
Program Memory Type
OTP
Ram Size
336 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFQFP
Controller Family/series
PIC16C
No. Of I/o's
25
Ram Memory Size
336Byte
Cpu Speed
20MHz
No. Of Timers
3
Interface
I2C, SPI
Embedded Interface Type
I2C, SPI
Rohs Compliant
Yes
Processor Series
PIC16LC
Core
PIC
Data Bus Width
8 bit
Data Ram Size
336 B
Interface Type
I2C, SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
25
Number Of Timers
1 x 16 bit
Operating Supply Voltage
2.5 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
5 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16LC926-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC16LC926-I/PT
Manufacturer:
MIC
Quantity:
20 000
PIC16C925/926
68-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
DS39544A-page 164
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-049
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Side 1 Chamfer Height
Corner Chamfer 1
Corner Chamfer (others)
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Footprint Width
Footprint Length
Lead Thickness
Upper Lead Width
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
c
CH2 x 45
#leads=n1
n
E2
Dimension Limits
E1
E
1
2
CH1 x 45
Units
CH1
CH2
A2
A3
D1
D2
A1
E1
E2
B1
n1
A
n
E
D
c
B
p
D1
MIN
D
A2
Preliminary
.165
.145
.020
.024
.040
.000
.985
.985
.950
.950
.890
.890
.008
.026
.013
0
0
32
INCHES*
NOM
A
.050
.173
.153
.028
.029
.045
.005
.990
.990
.954
.954
.920
.920
.011
.029
.020
68
17
5
5
A3
MAX
.180
.160
.035
.034
.050
.010
.995
.995
.958
.958
.930
.930
.013
.032
.021
10
10
B1
B
MIN
25.02
25.02
24.13
24.13
22.61
22.61
4.19
3.68
1.02
0.00
0.20
0.66
0.33
0.51
0.61
D2
0
0
MILLIMETERS
p
NOM
2001 Microchip Technology Inc.
25.15
25.15
24.23
24.23
23.37
23.37
4.39
1.27
3.87
0.71
0.74
1.14
0.13
0.27
0.74
0.51
68
17
5
5
A1
MAX
25.27
25.27
24.33
24.33
23.62
23.62
4.57
4.06
0.89
0.86
1.27
0.25
0.33
0.81
0.53
10
10