PIC24FJ192GB110-I/PT Microchip Technology, PIC24FJ192GB110-I/PT Datasheet - Page 68
![IC PIC MCU FLASH 100TQFP](/photos/12/13/121330/c04-100-tqfp_sml.jpg)
PIC24FJ192GB110-I/PT
Manufacturer Part Number
PIC24FJ192GB110-I/PT
Description
IC PIC MCU FLASH 100TQFP
Manufacturer
Microchip Technology
Series
PIC® 24Fr
Datasheets
1.PIC24FJ128GA106-IPT.pdf
(52 pages)
2.PIC24FJ64GB106-IPT.pdf
(16 pages)
3.PIC24FJ64GB106-IPT.pdf
(352 pages)
4.PIC24FJ192GB108-IPT.pdf
(328 pages)
Specifications of PIC24FJ192GB110-I/PT
Program Memory Type
FLASH
Program Memory Size
192KB (65.5K x 24)
Package / Case
100-TFQFP
Core Processor
PIC
Core Size
16-Bit
Speed
32MHz
Connectivity
I²C, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
83
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
I2C/SPI/UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
84
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240011, DM240001
Minimum Operating Temperature
- 40 C
On-chip Adc
16-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM240011 - KIT STARTER MPLAB FOR PIC24F MCUMA240014 - MODULE PLUG-IN PIC24
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24FJ192GB110-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC24FJ128GA106-IPT PDF datasheet
- PIC24FJ64GB106-IPT PDF datasheet #2
- PIC24FJ64GB106-IPT PDF datasheet #3
- PIC24FJ192GB108-IPT PDF datasheet #4
- Current page: 68 of 352
- Download datasheet (3Mb)
PIC24FJ256GB110 FAMILY
EXAMPLE 5-4:
EXAMPLE 5-5:
EXAMPLE 5-6:
DS39897C-page 68
// C example using MPLAB C30
//Set up NVMCON for row programming
//Set up pointer to the first memory location to be written
//Perform TBLWT instructions to write necessary number of latches
for(i=0; i < 2*NUM_INSTRUCTION_PER_ROW; i++)
// C example using MPLAB C30
asm("DISI #5");
__builtin_write_NVM();
#define NUM_INSTRUCTION_PER_ROW 64
unsigned int offset;
unsigned int i;
unsigned long progAddr = 0xXXXXXX;
unsigned int progData[2*NUM_INSTRUCTION_PER_ROW];
NVMCON = 0x4001;
TBLPAG = progAddr>>16;
offset = progAddr & 0xFFFF;
{
}
__builtin_tblwtl(offset, progData[i++]);
__builtin_tblwth(offset, progData[i]);
offset = offset + 2;
DISI
MOV
MOV
MOV
MOV
BSET
NOP
NOP
BTSC
BRA
#5
#0x55, W0
W0, NVMKEY
#0xAA, W1
W1, NVMKEY
NVMCON, #WR
NVMCON, #15
$-2
LOADING THE WRITE BUFFERS (C LANGUAGE CODE)
INITIATING A PROGRAMMING SEQUENCE (ASSEMBLY LANGUAGE CODE)
INITIATING A PROGRAMMING SEQUENCE (C LANGUAGE CODE)
// Block all interrupts with priority < 7
// for next 5 instructions
// Perform unlock sequence and set WR
; Block all interrupts with priority <7
; for next 5 instructions
; Write the 55 key
;
; Write the AA key
; Start the erase sequence
;
;
; and wait for it to be
; completed
// Buffer of data to write
// Write to address low word
// Write to upper byte
// Address of row to write
// Initialize NVMCON
// Initialize PM Page Boundary SFR
// Initialize lower word of address
// Increment address
2009 Microchip Technology Inc.
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