PIC16C64A-10/P Microchip Technology, PIC16C64A-10/P Datasheet - Page 113

IC MCU OTP 2KX14 PWM 40DIP

PIC16C64A-10/P

Manufacturer Part Number
PIC16C64A-10/P
Description
IC MCU OTP 2KX14 PWM 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr

Specifications of PIC16C64A-10/P

Core Size
8-Bit
Program Memory Size
3.5KB (2K x 14)
Oscillator Type
External
Core Processor
PIC
Speed
10MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
33
Program Memory Type
OTP
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Operating Temperature
0°C ~ 70°C
Package / Case
40-DIP (0.600", 15.24mm)
Controller Family/series
PIC16C
No. Of I/o's
33
Ram Memory Size
128Byte
Cpu Speed
10MHz
No. Of Timers
3
No. Of Pwm
RoHS Compliant
Rohs Compliant
Yes
Embedded Interface Type
I2C, SPI
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16C64A-10/PQ
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC16C64A-10/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
14.2
1996 Microchip Technology Inc.
*Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask rev#, and
assembly code. For OTP marking beyond this, certain price adders apply. Please check with your Microchip
Sales Office. For QTP devices, any special marking adders are included in QTP price.
Legend: MM...MMicrochip part number information
XX...X
AA
BB
C
D
E
Note:In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next
line thus limiting the number of available characters for customer specific information.
40-Lead PDIP
44-Lead PLCC
44-Lead TQFP
40-Lead CERDIP Windowed
Package Marking Information
MMMMMMMM
XXXXXXXXXX
XXXXXXXXXX
MMMMMMMMMMMMMM
XXXXXXXXXXXXXXXXXX
AABBCDE
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
C = Chandler, Arizona, U.S.A.
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
AABBCDE
MMMMMMMM
XXXXXXXXXX
XXXXXXXXXX
AABBCDE
MMMMMMMMM
XXXXXXXXXXX
XXXXXXXXXXX
AABBCDE
Preliminary
PIC16C64X & PIC16C66X
Example
Example
Example
Example
PIC16C662
-20/TQ
PIC16C662-04/P
AABBCDE
AABBCDE
PIC16C662
-20/L
9512CAA
PIC16C662/JW
AABBCDE
DS30559A-page 113

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