PIC18LF252-I/SOG Microchip Technology, PIC18LF252-I/SOG Datasheet - Page 261

IC MCU FLASH 16KX16 28SOIC

PIC18LF252-I/SOG

Manufacturer Part Number
PIC18LF252-I/SOG
Description
IC MCU FLASH 16KX16 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18LF252-I/SOG

Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
23
Program Memory Size
32KB (16K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
22.0
Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................-55°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to V
Voltage on V
Voltage on MCLR with respect to V
Voltage on RA4 with respect to Vss ............................................................................................................... 0V to +8.5V
Total power dissipation (Note 1) ...............................................................................................................................1.0W
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by PORTA, PORTB, and PORTE (Note 3) (combined) ...................................................200 mA
Maximum current sourced by PORTA, PORTB, and PORTE (Note 3) (combined)..............................................200 mA
Maximum current sunk by PORTC and PORTD (Note 3) (combined)..................................................................200 mA
Maximum current sourced by PORTC and PORTD (Note 3) (combined).............................................................200 mA
© 2006 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1: Power dissipation is calculated as follows:
2: Voltage spikes below V
3: PORTD and PORTE not available on the PIC18F2X2 devices.
ELECTRICAL CHARACTERISTICS
Pdis = V
Thus, a series resistor of 50-100 should be used when applying a “low” level to the MCLR/V
than pulling this pin directly to V
DD
with respect to V
DD
IK
OK
x {I
(V
DD
I
SS
(V
DD
< 0 or V
pin ..............................................................................................................................250 mA
O
pin ...........................................................................................................................300 mA
- ∑ I
(†)
< 0 or V
SS
OH
I
SS
SS
SS
> V
......................................................................................................... -0.3V to +7.5V
} + ∑ {(V
at the MCLR/V
(Note 2) ......................................................................................... 0V to +13.25V
O
(except V
DD
> V
)
SS
DD
DD
.
)
-V
DD
OH
, MCLR, and RA4) ......................................... -0.3V to (V
) x I
PP
pin, inducing currents greater than 80 mA, may cause latchup.
OH
} + ∑(V
O
l x I
OL
)
PIC18FXX2
DS39564C-page 259
PP
DD
pin, rather
+ 0.3V)
20 mA
20 mA

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